2023
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Untersuchungen zur Temperaturverteilung in Steckverbindungen im Drehstromsystem bei kurzzeitiger StrombelastungPomsel, M., Hildmann, C., Schlegel, S., Israel, T. & Kufner, T.,
27 Sep 2023,
Kontaktverhalten und Schalten: 27. VDE-Fachtagung Albert-Keil-Kontaktseminar, 27. - 29. September 2023 am Karlsruher Institut für Technologie (KIT).
p. 128–137Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Diffusion of Silver in Liquid Tin Depending on the Temperature Gradient Along the Solder in Low-Voltage Power Fuses at OvercurrentsBüttner, L., Hildmann, C., Skrotzki, W. & Schlegel, S.,
26 Jun 2023,
In: IEEE Transactions on Components, Packaging and Manufacturing Technology.
13,
6,
p. 849-858,
10 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
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