2023

• SAP: Subchain-Aware NFV Service Placement in Mobile Edge CloudDoan, T. V., Nguyen, G. T., Reisslein, M. & Fitzek, F. H. P., 1 Mar 2023, In: IEEE Transactions on Network and Service Management. 20, 1, p. 319-341, 23 p., 9866548Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Adaptive Network Coding: Achieving a Reliability-Latency Tradeoff for 5G and 6G SystemsLhamo, O., Doan, T. V., Nguyen, G. T. & Fitzek, F. H., 2023, 2023 IEEE Conference on Network Function Virtualization and Software Defined Networks, NFV-SDN 2023 - Proceedings. Fitzek, F. H., Horner, L., Gharbaoui, M., Nguyen, G., Gu, R. & Meuser, T. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 193-196, 4 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• A Secure and Resilient 6G Architecture Vision of the German Flagship Project 6G-ANNAHoffmann, M., Kunzmann, G., Dudda, T., Irmer, R., Jukan, A., MacHer, G., Ahmad, A. & 25 others, 2023, In: IEEE access. 11, p. 102643-102660, 18 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Bridging the Gap: 5G-TSN Integration for Industrial Robotic CommunicationNazari, H. K., Abicht, J., Senk, S., Liu, H. H., Scheinert, T., Nguyen, G. T. & Fitzek, F. H., 2023, 28th European Wireless Conference, EW 2023. VDE Verlag, Berlin [u. a.], p. 95-102, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• H.264 Compress-Then-Analyze Transmission in Edge-Assisted Visual SLAMHofer, J., Steinke, J., Sossalla, P., Nguyen, G. T. & Fitzek, F. H., 2023, 28th European Wireless Conference, EW 2023. VDE Verlag, Berlin [u. a.], p. 123-128, 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• HORA: Joint Handover and Resource Allocation on 3D Networks for Industrial IoTZhang, J., Hartmann, C., Sossalla, P., Nguyen, G. & Fitzek, F. H., 2023, 28th European Wireless Conference, EW 2023. VDE Verlag, Berlin [u. a.], p. 36-41, 6 p.Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Hybrid Testbed for Security Research in Software-Defined NetworksWindisch, F., Abedi, K., Doan, T., Strufe, T. & Nguyen, G. T., 2023, 2023 IEEE Conference on Network Function Virtualization and Software Defined Networks, NFV-SDN 2023 - Proceedings. Fitzek, F. H., Horner, L., Gharbaoui, M., Nguyen, G., Gu, R. & Meuser, T. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 147-152, 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Improving Reliability for Cloud-Native 5G and Beyond Using Network CodingLhamo, O., Doan, T. V., Tasdemir, E., Attawna, M., Senk, S., Fitzek, F. H. & Nguyen, G. T., 2023, 2023 IEEE Conference on Network Function Virtualization and Software Defined Networks, NFV-SDN 2023 - Proceedings. Fitzek, F. H., Horner, L., Gharbaoui, M., Nguyen, G., Gu, R. & Meuser, T. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 1-7, 7 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Incremental Joint Scheduling and Routing for 5G-TSN IntegrationNazari, H. K., Kurt, M. A., Liu, H. H., Senk, S., Nguyen, G. T. & Fitzek, F. H., 2023, 28th European Wireless Conference, EW 2023. VDE Verlag, Berlin [u. a.], p. 103-109, 7 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• In-Network Path Planning for Autonomous DrivingDoan, T. V., Fitzek, F. H. & Nguyen, G. T., 2023, 2023 IEEE Conference on Network Function Virtualization and Software Defined Networks, NFV-SDN 2023 - Proceedings. Fitzek, F. H., Horner, L., Gharbaoui, M., Nguyen, G., Gu, R. & Meuser, T. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 175-177, 3 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution