Publications - Karslioglu

2009

• Modelling of vibrocompaction using hypoplasticity with intergranular strainsHerle, I. & Arnold, M., 2009, p. 2334-2337, 4 p.Research output: Contribution to conferences > Paper
• Physikalische und mechanische Eigenschaften von weichen Kippenböden - Experimente und TheorieHerle, I., Herbstova, V., Masin, D. & Karcher, C., 2009, p. 460-465, 6 p.Research output: Contribution to conferences > Paper
• Standsicherheitsberechnungen von Böschungen mit der φ/c-ReduktionKupka, M., 2009, p. 101-117, 17 p.Research output: Contribution to conferences > Paper
• Structure transitions of clay fills in North-Western BohemiaHerbstova, V. & Herle, I., 2009, In: Engineering Geology. 104, 3-4, p. 157-166Electronic (full-text) versionResearch output: Contribution to journal > Research article

2008

• Advanced calculations of safety factors for slope stabilityKupka, M., Herle, I. & Arnold, M., 2008, p. 4470-4477, 8 p.Research output: Contribution to conferences > Paper
• A hypoplastic model for clays improved for undrained ConditionsMasin, D. & Herle, I., 2008, p. 645-652, 8 p.Electronic (full-text) versionResearch output: Contribution to conferences > Paper
• Application of the Intergranular strain concept to the hypoplastic modelling of non-adhesive interfacesArnold, M., 2008, p. 747-754, 8 p.Research output: Contribution to conferences > Paper
• Backfill and surcharge induced loads of cantilever retaining wallsArnold, M., 2008, Proceedings of the Second International British Geotechnical Association International Conference on Foundations - ICOF 2008, 24-27 June 2008. p. 641-652, 12 p.Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Comparison of vibrocompaction methods by numerical simulationsArnold, M., Herle, I. & Wehr, J., 2008, p. 3-11, 9 p.Research output: Contribution to conferences > Paper
• Demonstration experiments in geotechnical educationHerle, I. & Gesellmann, S., 2008, p. 379-382, 4 p.Research output: Contribution to conferences > Paper