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Killge, S.; Bartussek, I.; Junige, M.; Neumann, V.; Wenzel, C.; Böttcher, M.; Albert, M.; Wolf, M.J.; Bartha, J.W.: 3D system integration on 300 mm wafer level : high-aspect-ratio TSVs with ruthenium seed layer by thermal ald and subsequent copper electroplating. In: Materials for Advanced Metallization : March 26-29, 2017, Dresden, Germany. Dresden, 2017 (2017)

Wenger, C.; Chavarin, C.A.; Strobel, C.; Junige, M.; Kitzmann, J.; Lukosius, M.; Lupina, G.; Albert, M.; Bartha, J.W.: Towards Graphene-based heterojunction devices for microelectronic applications. In: Graphene 2017 : March 28-31, 2017, Barcelona, Spain. Barcelona, 2017 (2017)

Junige, M.; Kitzmann, J.; Chavarin, C.A.; Geidel, M.; Reif, J.; Albert, M.; Lupina, G.; Wenger, C.; Bartha, J.W.: In-situ real-time and in-vacuo study of the temperature impact on the Al2O3 ALD nucleation upon pristine monolayer graphene. In: AVS 17th International Conference on Atomic Layer Deposition : July 15 – 18, 2017, Denver, Colorado, USA. Denver, 2017 (2017)

Junige, M.; Kitzmann, J.; Geidel, M.; Lupina, G.; Albert, M.; Wenger, C.; Bartha, J.W.: Al2O3 ALD on pristine graphene. In: DPG-Frühjahrstagung der Sektion Kondensierte Materie. Dresden, 2017 Vortrag (2017)

Neumann, N.; Charania, S.; Killge, S.; al-Husseini, Z.; Henker, R.; Ellinger, F.; Bartha, J.W.; Plettemeier, D.: Modeling and characterization of optical TSVs . In: SPIE 10325, Optical Fibers and Their Applications 2017, 103250O, Optical Fibers and Their Applications 2017, Supraśl, Poland, Poland | January 23, 2017 (2017)

Mehner, P. J.; Häfner, S.; Franke, M.; Voigt, A.; Marschner, U.; Richter, A.: Finite Element Model of a Hydrogel-Based Micro-Valve. In: ASME 2016 Conference on Smart Materials, Adaptive Structures and Intelligent Systems Volume 2: Modeling, Simulation and Control; Bio-Inspired Smart Materials and Systems; Energy Harvesting - Stowe, Vermont, USA, September 28–30, 2016 SMASIS2016-9181, pp. V002T03A016; 8 pages (2016)

Killge, S.; Charania, S.; Richter, K.; Bartha, J.W.: Towards the realization of optical interconnets on Si interposer. In: Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2016 IEEE International, 23-26 May 2016 (2016)

Millat, S.; Hoeft, J. T.; Bartha, J.W.: SEM Based Overlay - development of dedicated workflow using new imaging capability on CD-SEM for inline process control within Semiconductor manufacturing environment. In: Conference: 16TH EUROPEAN ADVANCED PROCESS CONTROL AND MANUFACTURING (APC|M) CONFERENCE, At Reutlingen (Stuttgart), GERMANY (2016)

Killge, S.; Junige, M.; Geidel, M.; Neumann, V.; Wenzel, C.; Knaut, M.; Albert, M.; Bartha, J.W.: 3D integration: ALD Ruthenium layers grown on metallic and oxide interfaces for TSV with high aspect ratios – Why blisters? In: MAM 2016 – Materials for advanced metalization : 20th – 23th March 2016, Brussels, Belgium. Brussels, 2016 (2016)

Lupina, G.; Strobel, C.; Junige, M.; Kitzmann, J.; Lukosius, M.; Albert, M.; Bartha, J.W.; Wenger, C.: Dielectric-Graphene and Silicon-Graphene integration for Graphene-Based Devices. In: Graphene 2016 : April 19-22, 2016, Genoa, Italy. Genoa, 2016 (2016)

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Philipp Wenskus
Letzte Änderung: 07.02.2018