Veröffentli­chungen 2012

1 bis 10 von 82 Einträgen

Greiner, R.; Allerdißen, M.; Voigt, A.; Richter, A.: Fluidic microchemomechanical integrated circuits processing chemical information. In: Lab Chip 12 (2012), Nr. 23, S. 5034–5044

Wojcik, H.; Junige, M.; Bartha, J.W.; Albert, M.; Neumann, V.; Merkel, U.; Peeva, A.; Gluch, J.; Menzel, S.; Munnik, F.; Liske, R.; Utess, D.; Richter, I.; Klein, C.; Engelmann, H.-J.; Hoßbach, C.; Wenzel, C.: Physical Characterization of PECVD and PEALD Ru(-C) Films and Comparison with PVD Ruthenium Film Properties. In: Journal of The Electrochemical Society 159 (2012), Nr. 2, S. 166–176

Knaut, M.; Junige, M.; Albert, M.; Bartha, J.W.: In-situ real-time ellipsometric investigations during the atomic layer deposition of ruthenium: A process development from [(ethylcyclopentadienyl)(pyrrolyl)ruthenium] and molecular oxygen. In: Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 30 (2012), 01A151-01A151-9 (2012)

Shimizu, H.; Woijcik, H.; Shima, K.; Kobayashi, Y.; Momose, T.; Bartha, J. W.; Shimogaki, Y.: Comparative study on ALD/CVD-Co(W) films as a single barrier/liner layer for 22−1x nm generation interconnects . In: Interconnect Technology Conference (IITC), 2012 IEEE International, San Jose, CA, 4-6 June 2012 (2012), S. 1–3

Zimmermann, T.; Flikweert, A. J.; Merdzhanova, T.; Woerdenweber, J.; Gordijn, A.; Dybek, K.; Stahr, F.; Bartha, J. W.: High-Rate Deposition of Intrinsic a-Si:H and μc-Si:H Layers for Thin‑Film Silicon Solar Cells using a Dynamic Deposition Process. In: MRS Spring Meeting, 2012 1426 (2012)

He, J.; Howitz, S.; Richter, K.; Bartha, J. W.; Moench, J. I.: Pattern transfer from the e-beam resist, over the nanoimprint resist and to the final silicon substrate. In: Proc. SPIE 8328, Advanced Etch Technology for Nanopatterning, 83280S (17 March 2012) (2012)

Thrun, X.; Choj, K.-H.; Freitag, M.; Grenville, A.; Gutsch, M.; Hohle, C.; Stowers, J. K.; Bartha, J. W.: Demonstration of 22nm SRAM features with patternable hafnium oxide-based resist material using electron-beam lithography. In: Proc. SPIE 8325, Advances in Resist Materials and Processing Technology XXIX, 832518 (19 March 2012), San Jose, California, USA, February 2012 (2012)

He, J.; Howitz, S.; Killge, S.; Richter, K.; Bartha, J. W.: Deformations of soft imprint templates in the nanoimprint lithography. In: Proc. SPIE 8323, Alternative Lithographic Technologies IV, 83231B (March 1, 2012), Alternative Lithographic Technologies IV, San Jose, California, February 12, 2012 (2012)

Wojcik, H.; Kaltofen, R.; Merkel, U.; Krien, C.; Strehle, S.; Gluch, J.; Knaut, M.; Wenzel, C.; Preusse, A.; Bartha, J.W.; Geidel, M.; Adolphi, B.; Neumann, V.; Liske, R.; Munnik, F.: Electrical Evaluation of Ru-W(-N), Ru-Ta(-N) and Ru-Mn films as Cu diffusion barriers. In: Microelectronic Engineering, 27th Annual Advanced Metallization Conference 2010 92 (2012), S. 71–75

Vogel, U.; Klaus, C.; Nobis, C.; Bartha, J.W.: Analysis of the energy input during wire coating from a cylindrical magnetron source. In: Thin Solid Films 520 (2012), Nr. 20, S. 6404–6408

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Dr. Steffen Strehle
Letzte Änderung: 14.09.2016