Veröffentlichte Journal-Beiträge

41 bis 50 von 107 Einträgen

Vasilev, B.; Bott, S.; Rzehak, R.; Bartha, J. W.: Pad roughness evolution during break-in and its abrasion due to the pad-wafer contact in oxide CMP. In: Microelectronic Engineering 111 (2013), S. 21–28

Lüssem, B.; Tietze, M. L.; Kleemann, H.; Hossbach, C.; Bartha, J. W.; Zakhidov, A.; Leo, K.: Doped organic transistors operating in the inversion and depletion regime. In: Nature Communications 4 (2013), Nr. Article number: 2775

Dirnstorfer, D.; Mähne, H.; Mikolajick, T.; Knaut, M.; Albert, M.; Dubnack, K.: Atomic layer deposition of anatase TiO2 on porous electrodes for dye-sensitized solar cells. In: J. Vac. Sci. Technol. A31, 01A116 (2013) (2013)

Wojcik, H.; Junige, M.; Bartha, J.W.; Albert, M.; Neumann, V.; Merkel, U.; Peeva, A.; Gluch, J.; Menzel, S.; Munnik, F.; Liske, R.; Utess, D.; Richter, I.; Klein, C.; Engelmann, H.-J.; Hoßbach, C.; Wenzel, C.: Physical Characterization of PECVD and PEALD Ru(-C) Films and Comparison with PVD Ruthenium Film Properties. In: Journal of The Electrochemical Society 159 (2012), Nr. 2, S. 166–176

Knaut, M.; Junige, M.; Albert, M.; Bartha, J.W.: In-situ real-time ellipsometric investigations during the atomic layer deposition of ruthenium: A process development from [(ethylcyclopentadienyl)(pyrrolyl)ruthenium] and molecular oxygen. In: Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 30 (2012), 01A151-01A151-9 (2012)

Zimmermann, T.; Flikweert, A. J.; Merdzhanova, T.; Woerdenweber, J.; Gordijn, A.; Dybek, K.; Stahr, F.; Bartha, J. W.: High-Rate Deposition of Intrinsic a-Si:H and μc-Si:H Layers for Thin‑Film Silicon Solar Cells using a Dynamic Deposition Process. In: MRS Spring Meeting, 2012 1426 (2012)

He, J.; Howitz, S.; Richter, K.; Bartha, J. W.; Moench, J. I.: Pattern transfer from the e-beam resist, over the nanoimprint resist and to the final silicon substrate. In: Proc. SPIE 8328, Advanced Etch Technology for Nanopatterning, 83280S (17 March 2012) (2012)

Wojcik, H.; Kaltofen, R.; Merkel, U.; Krien, C.; Strehle, S.; Gluch, J.; Knaut, M.; Wenzel, C.; Preusse, A.; Bartha, J.W.; Geidel, M.; Adolphi, B.; Neumann, V.; Liske, R.; Munnik, F.: Electrical Evaluation of Ru-W(-N), Ru-Ta(-N) and Ru-Mn films as Cu diffusion barriers. In: Microelectronic Engineering, 27th Annual Advanced Metallization Conference 2010 92 (2012), S. 71–75

Vogel, U.; Klaus, C.; Nobis, C.; Bartha, J.W.: Analysis of the energy input during wire coating from a cylindrical magnetron source. In: Thin Solid Films 520 (2012), Nr. 20, S. 6404–6408

Thrun, X.; Choj, K.-H.; Freitag, M.; Grenville, A.; Gutsch, M.; Hohle, C.; Stowers, J. K.; Bartha, J. W.: Evaluation of direct patternable inorganic spin-on hard mask materials using electron beam lithography. In: Microelectronic engineering 98 98 (2012), S. 226–229

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Philipp Wenskus
Letzte Änderung: 05.10.2022