Publications 2011

11 bis 20 von 28 Einträgen

Knaut, M.; Albert, M.; Bartha, J.W.: QCM sensors for advanced process development and control. In: Proceedings of 11th AVS ALD Conference, Cambridge, Massachusetts, USA (2011)

Henke, T.; Geidel, M.; Knaut, M.; Albert, M.; Bartha, J.W.: Flash Light Induced Atomic Layer Deposition. In: Subtherm 2011 – International Topical Workshop on Subsecond Thermal Processing of Advanced Materials, October 25 – 27, 2011, Dresden (2011)

Henke, T.; Geidel, M.; Knaut, M.; Albert, M.; Bartha, J.W.: Flash-ALD - A Novel Approach for Atomic Layer Controlled Growth of Thin Films Induced by Flash Heating. In: Proceedings of AVS 11th International Conference on Atomic Layer Deposition, June 26 – 29, 2011, Cambridge, Massachusetts, USA (2011)

Wojcik, H.; Lehninger, D.; Neumann, V.; Bartha, J.W.: Characterization of barrier and seed layer integrity for copper interconnects. In: Semiconductor Conference Dresden (SCD), 27-28 Sept. 2011 (2011)

Neumann, V.; Hiess, A.; Jahn, A.; Merkel, U.; Richter, K.; Viehweger, K.; Wenzel, C.; Bartha, J.W.: A Through Silicon Via concept for sensor applications. In: Semiconductor Conference Dresden (SCD), 27-28 Sept. 2011 (2011)

Leszczynska, B.; Strobel, C.; Albert, M.; Bartha, J.W.; Stephan, U.; Kuske, J.: Influence of excitation frequencies (81.36 – 120 MHz) in the VHF – PECVD technique on the deposition rate and properties of silicon thin-film solar cells. In: Proc. of the 26th European Photovoltaic Solar Energy Conference, Hamburg 2011 (2011)

Leszczynska, B.; Strobel, C.; Albert, M.; Zimmermann, T.; Kuske, J.; Bartha, J.W.: Dynamic VHF-PECVD technique for flexible substrate coating. In: Proc. of the 54th Annual SVC Technical Conference, Chicago 2011 (2011)

Wojcik, H.; Kaltofen, R.; Merkel, U.; Krien, C.; Strehle, S.; Gluch, J.; Knaut, M.; Wenzel, C.; Preusse, A.; Bartha, J.W.; Geidel, M.; Adolphi, B.; Neumann, V.; Liske, R.; Munnik, F.: Electrical Evaluation of Ru–W(-N), Ru–Ta(-N) and Ru–Mn films as Cu diffusion barriers. In: Microelectronic Engineering, Available online 27 May 2011 (2011)

Wojcik, H.; Merkel, U.; Jahn, A.; Richter, K.; Junige, M.; Klein, C.; Gluch, J.; Albert, M.; Munnik, F.; Wenzel, C.; Bartha, J.W.: Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu diffusion barriers by means of bias temperature stress measurements. In: Microelectronic Engineering 88 (2011), Nr. 5, S. 641–645

Wojcik, H.; Kaltofen, R.; Krien, C.; Merkel, U.; Wenzel, C.; Bartha, J.W.; Friedemann, M.; Adolphi, B.; Liske, R.; Neumann, V.; Geidel, M.: Investigations on Ru-Mn films as plateable Cu diffusion barriers. In: In: Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International, 2011 (2011), S. 1–3

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Dr. Steffen Strehle
Last modified: Aug 09, 2016