Publications
668 Entries
2023
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A highly reliable 1.8 V 1 Mb Hf0.5Zr0.5O2-based 1T1C FeRAM Array with 3-D Capacitors, 2023, 2023 International Electron Devices Meeting, IEDM 2023. Institute of Electrical and Electronics Engineers (IEEE), p. 1-4Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Atomic layer etching of nanowires using conventional reactive ion etching tool, 2023, In: Journal of Physics: Conference Series. 2443, 1, 012004Electronic (full-text) versionResearch output: Contribution to journal > Conference article
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Bridging Large-Signal and Small-Signal Responses of Hafnium-Based Ferroelectric Tunnel Junctions, 2023, 2023 35th International Conference on Microelectronic Test Structure (ICMTS). Tokyo: Institute of Electrical and Electronics Engineers (IEEE)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Demonstration of a Non-Volatile Antiferroelectric Pyroelectric Switch, 2023, 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023. Institute of Electrical and Electronics Engineers (IEEE), p. 256-259, 4 p.Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Design Enablement Flow for Circuits with Inherent Obfuscation based on Reconfigurable Transistors, 2023, 2023 Design, Automation and Test in Europe Conference and Exhibition, DATE 2023 - Proceedings. Institute of Electrical and Electronics Engineers (IEEE)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Dielectric Confined Nickel-Titanium Germano-Silicide Junctions to SiGe Nanochannels, 2023, 2023 IEEE Nanotechnology Materials and Devices Conference, NMDC 2023. Institute of Electrical and Electronics Engineers (IEEE), p. 416-420, 5 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Evaluation of Schottky barrier height at Silicide/Silicon interface of a Silicon Nanowire with Modulation Acceptor Doped Dielectric Shell, 2023, In: Device Research Conference (DRC)Electronic (full-text) versionResearch output: Contribution to journal > Conference article
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Formal Analysis of Camouflaged Reconfigurable Circuits, 2023, 2023 21st IEEE Interregional NEWCAS Conference (NEWCAS). Institute of Electrical and Electronics Engineers (IEEE)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Investigation of Recovery Phenomena in Hf0.5Zr0.5O2-based 1T1C FeRAM, 2023, In: IEEE journal of the Electron Devices Society. 11, p. 43-46, 4 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
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I-V-T Characteristics and Temperature Sensor Performance of a Fully-2D WSe2/MoS2 Heterojunction Diode at Cryogenic Temperatures, 2023, In: IEEE journal of the Electron Devices Society. 11, p. 359-366, 8 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article