Publications

2021

• Back-bias reconfigurable field effect transistor: A flexible add-on functionality for 22 nm FDSOISessi, V., Simon, M., Slesazeck, S., Drescher, M., Mulaosmanovic, H., Li, K., Binder, R. & 13 others, 2021, 2021 Silicon Nanoelectronics Workshop, SNW 2021. Institute of Electrical and Electronics Engineers (IEEE), 2 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Control Strategies to Optimize Graph Coloring via M-CNNs with Locally-Active NbOx MemristorsAscoli, A., Weiher, M., Tetzlaff, R., Herzig, M., Slesazeck, S. & Mikolajick, T., 2021Research output: Contribution to conferences > Paper
• Demonstration of 1T1C FeRAM Arrays for Nonvolatile Memory ApplicationsOkuno, J., Kunihiro, T., Konishi, K., Maemura, H., Shuto, Y., Sugaya, F., Materano, M. & 8 others, 2021, 2021 20th International Workshop on Junction Technology (IWJT). Institute of Electrical and Electronics Engineers (IEEE)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• FeFET based Logic-in-Memory: an overviewMarchand, C., O’Connor, I., Cantan, M., Breyer, E. T., Slesazeck, S. & Mikolajick, T., 2021, Proceedings - 2021 16th International Conference on Design and Technology of Integrated Systems in Nanoscale Era, DTIS 2021. Institute of Electrical and Electronics Engineers (IEEE), 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Ferroelectric Tunneling Junctions for Edge ComputingCovi, E., Duong, Q. T., Lancaster, S., Havel, V., Coignus, J., Barbot, J., Richter, O. & 6 others, 2021, 2021 IEEE International Symposium on Circuits and Systems, ISCAS 2021 - Proceedings. Institute of Electrical and Electronics Engineers (IEEE), 9401800Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Integration and Reliability Aspects of Low-Temperature and Au-free Ta/Al-based Ohmic Contacts for AlGaN/GaN MIS-HEMTsCalzolaro, A., Mikolajick, T. & Wachowiak, A., 2021, ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference (ESSDERC). p. 307-310, 4 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Mechanism of Retention Degradation after Endurance Cycling of HfO₂-based Ferroelectric TransistorsZhou, H., Ocker, J., Pesic, M., Padovani, A., Trentzsch, M., Dünkel, S., Müller, J. & 5 others, 2021, 2021 Symposium on VLSI Technology. Kyoto: Institute of Electrical and Electronics Engineers (IEEE)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Polarization switching and interface charges in BEOL compatible Ferroelectric Tunnel JunctionsFontanini, R., Barbot, J., Segatto, M., Lancaster, S., Duong, Q., Driussi, F., Grenouillet, L. & 5 others, 2021, ESSDERC 2021 - IEEE 51st European Solid-State Device Research Conference, Proceedings. Editions Frontieres, p. 255-258, 4 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• RF small-signal modeling of HCI degradation in FDSOI NMOSFET using BSIM-IMGGonzalez, F. A. V., Lange, A., Chohan, T. & Mikolajick, T., 2021, 2021 IEEE International Integrated Reliability Workshop (IIRW). p. 33-37, 5 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• What Influences Surface Plasmon Resonance Linewidth in MIM Structures Obtained by Colloidal Self-AssemblyYu, Y., Schletz, D., Reif, J., Winkler, F., Albert, M., Fery, A. & Kirchner, R., 2021, In: International Conference on Metamaterials, Photonic Crystals and Plasmonics. p. 1051-1052, 2 p.Research output: Contribution to journal > Conference article