Publications

2019

• Thermal condition monitoring of a motorized milling spindleBrecher, C., Ihlenfeldt, S., Neus, S., Steinert, A. & Galant, A., 1 Oct 2019, In: Production engineering. 13, 5, p. 539-546, 8 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Wireless control communications co-design via application-adaptive resource managementScheuvens, L., Hößler, T., Barreto, A. N. & Fettweis, G. P., 1 Oct 2019, 2019 IEEE 2nd 5G World Forum (5GWF). p. 298-303Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Adapted measuring sequence for the determination of directional-dependent dynamic material properties using a bending resonance methodDannemann, M., Holeczek, K., Leimert, J., Friebe, S. & Modler, N., Oct 2019, In: Polymer Testing. 79, 106044Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Adaptive fiber-reinforced plastics based on open reed weaving and tailored fiber placement technologyAshir, M., Nocke, A. & Cherif, C., Oct 2019, In: Textile Reseach Journal. 90, 9-10, p. 981-990, 10 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• A market oriented, reinforcement learning based approach for electric vehicles integration in smart micro gridsAbdelkader, A., Sychev, I., Bonetto, R. & Fitzek, F. H., Oct 2019, 2019 IEEE International Conference on Communications, Control, and Computing Technologies for Smart Grids, SmartGridComm 2019. Institute of Electrical and Electronics Engineers (IEEE), 8909698Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• A Mixed-Signal Offset-Compensation System for Multi-Gbit/s Optical Receiver FrontendsSzilagyi, L., Pliva, J., Henker, R. & Ellinger, F., Oct 2019, 27th IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC). Metzler, C., De Micheli, G., Gaillardon, P., Silva-Cardenas, C. & Reis, R. (eds.). IEEE Computer Society, p. 46-51, 6 p., 8920361Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• A novel hybrid DRAM/STT-RAM last-level-cache architecture for performance, energy, and endurance enhancementHameed, F. & Castrillon, J., Oct 2019, In: IEEE transactions on very large scale integration (VLSI) systems. 27, 10, p. 2375-2386, 12 p., 8734763Electronic (full-text) versionResearch output: Contribution to journal > Research article
• A Proposed Framework for Interactive Virtual Reality in Situ Visualization of Parallel Numerical SimulationsGupta, A., Günther, U., Incardona, P., Aydin, A. D., Dachselt, R., Gumhold, S. & Sbalzarini, I. F., Oct 2019, 2019 IEEE 9th Symposium on Large Data Analysis and Visualization, LDAV 2019. Institute of Electrical and Electronics Engineers (IEEE), p. 95-96, 2 p., 8944368Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• CLUSTERING ALGORITHMS FOR EX VIVO PERFUSED KIDNEYS IN NORMOTHERMIC MACHINE PERFUSIONKromnik, S., Thiele, C., Malberg, H. & Janssen, M., Oct 2019, In: Transplant international. 32, p. 32-32Research output: Contribution to journal > Meeting abstract
• Common Emitter Low Noise Amplifier with 19 dB Gain for 140 GHz to 220 GHz in 130 nm SiGeStarke, P., Steinweg, L., Carta, C. & Ellinger, F., Oct 2019, 2019 International Conference on Wireless and Mobile Computing, Networking and Communications, WiMob 2019. IEEE Computer Society, 8923164Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution