Publications

2019

• Numerical and experimental analysis on the influence of surface layer on the resistance spot welding process for the aluminum alloys 5182 and 6016Heilmann, S., Köberlin, D., Merx, M., Müller, J., Zschetzsche, J., Ihlenfeldt, S. & Füssel, U., 22 Sep 2019, In: Welding in the world. 63, p. 1205-1220, 16 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Modelling of dynamic dielectric elastomer actuators: Designing DE-loudspeaker driverBakardjiev, P., Altinsoy, M. E., Marschner, U., Richter, A. & Franke, M., 19 Sep 2019, APMM 2019Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Resistance of thermoplastic-laminated European beech veneer to mold fungi and white rot fungiStange, S. & Siegel, C., 18 Sep 2019Research output: Contribution to conferences > Poster
• Bridging the Gap between Smart Home Platforms and Machine Learning using Relational Reference Attribute Grammars.Schöne, R., Mey, J., Ren, B. & Aßmann, U., 17 Sep 2019, 2019 ACM/IEEE 22nd International Conference on Model Driven Engineering Languages and Systems Companion (MODELS-C). p. 533-542, 10 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Entwicklung eines hochproduktiven, richtungsunabhängigen WIG-Heißdrahtprozesses für die drahtbasierte additive Fertigung metallischer BauteileUngethüm, T., Spaniol, E., Hertel, M. & Füssel, U., 16 Sep 2019, DVS Berichte. Düsseldorf: DVS Media GmbH, Vol. 355. p. 7, 12 p.Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Impulsive stimulated Brillouin microscopy for non-contact, fast mechanical investigations of hydrogelsKrug, B., Koukourakis, N. & Czarske, J. W., 16 Sep 2019, In: Optics express. 27, 19, p. 26910-26923, 14 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Numerical study on the influence of material models for tin-based solder alloys on reliability statementsMetasch, R., Schwerz, R., Meier, K. & Roellig, M., 16 Sep 2019, 2019 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019. Institute of Electrical and Electronics Engineers (IEEE), 8951810Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Directional solidification of gallium under time-dependent magnetic fields with in situ measurements of the melt flow and the solid-liquid interfaceThieme, N., Keil, M., Meier, D., Bönisch, P., Dadzis, K., Pätzold, O., Stelter, M. & 2 others, 15 Sep 2019, In: Journal of crystal growth. 522, p. 221-229, 9 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Open Cognitive Control System ArchitectureManjiyani, Z., Iatrou, C. P., Graube, M. & Urbas, L., 13 Sep 2019, 2019 24th IEEE International Conference on Emerging Technologies and Factory Automation (ETFA). Institute of Electrical and Electronics Engineers (IEEE), p. 1673-1677, 5 p., 8869439Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Light-induced degradation in annealed and electron irradiated siliconLauer, K., Krischok, S., Klein, T., Bähr, M., Lawerenz, A., Röder, R., Ortlepp, T. & 1 others, 11 Sep 2019, In: Physica Status Solidi (A) Applications and Materials Science. 216, 17, 6 p., 1900284Electronic (full-text) versionResearch output: Contribution to journal > Research article