Publications

2024

• ZuSE-KI-Mobil AI Chip Design Platform: An OverviewMojumder, S., Friedrich, S. M., Matús, E., Fettweis, G., Lüders, M., Friedrich, M., Renke, O. & 14 others, 18 Nov 2024, 2024 IEEE Nordic Circuits and Systems Conference (NorCAS). Nurmi, J., Rodrigues, J., Pezzarossa, L., Aberg, V. & Behmanesh, B. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 1-7, 7 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Contact and long-term behavior of current-carrying connections in electrical power engineering: Theory and practice on behavior, calculation approaches, as well as design and dimensioning criteriaSchlegel, S., Gatzsche, M., Hildmann, C. & Israel, T., 16 Nov 2024, Springer Berlin / Heidelberg, 283 p.Electronic (full-text) versionResearch output: Book/Report/Anthology > Monograph
• Effektive Politikberatung unter Zeitdruck: Politician Science im Wissenstransfer: Wie kann die Politik zu schnellerem, proaktivem Handeln befähigt werden?Böhme, C., 15 Nov 2024Research output: Contribution to conferences > Presentation slides
• Fracture Behavior of a 2D Imine-Based PolymerZhang, B., Liu, X., Bodesheim, D., Li, W., Clausner, A., Liu, J., Jost, B. & 6 others, 13 Nov 2024, In: Advanced science. 11, 42, 2407017Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Integrating 3d printing into higher education curricula for electronics: challenges and opportunitiesPatela, S., Nieweglowski, K., Sniadek, P., Laszczyk, K., Koest, V. C., Weyers, D., Lettrichova, I. & 3 others, 13 Nov 2024, ICERI2024 Proceedings: 17th annual International Conference of Education, Research and Innovation. p. 8384-8392, 9 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Applying Quality by Design to Digital Twin Supported Scale-Up in Modular PlantsKoch, A., Ebert, J., Viedt, I., Mädler, J., Härtner, S., Marin Gallego, J., Weber, T. & 2 others, 12 Nov 2024Research output: Contribution to conferences > Presentation slides
• Embedded Silicon–Germanium-Based Thermoelectric Devices on 300-mm WaferSchwinge, C., Hoffmann, R., Biedermann, K., Czernohorsky, M., Kannan, J., Rudolph, M., Mende, F. & 3 others, 12 Nov 2024, In: IEEE Transactions on Electron Devices. 71 (2024), 12, p. 7794-7801, 8 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• A digital twin architecture for waste and recycling sorting plantsParbat, S., Iqbal, I. M., Viedt, I. & Urbas, L., 11 Nov 2024Research output: Contribution to conferences > Poster
• An ErMnO3 memristive spiking neuristorSchroedter, R., Demirkol, A. S., Wu, R., Dubourdieu, C. & Tetzlaff, R., 11 Nov 2024Research output: Contribution to conferences > Poster
• Efficiency and Safety in Waste Sorting: A Model Predictive Control Approach to Bale Press AutomationIqbal, I. M., Parbat, S., Viedt, I. & Urbas, L., 11 Nov 2024Research output: Contribution to conferences > Poster