2017

• Rare earth (RE: Nd, Dy, Ho, Y, Yb, and Sc) aluminosilicates for joining silicon carbide componentsHerrmann, M., Ahmad, S., Lippmann, W., Seifert, H. J. & Hurtado, A., 1 Jul 2017, In: International journal of applied ceramic technology. 14, 4, p. 675-691, 17 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• In silico modeling of structural and porosity properties of additive manufactured implants for regenerative medicineBrünler, R., Aibibu, D., Wöltje, M., Anthofer, A. & Cherif, C., Jul 2017, In: Materials Science and Engineering: C, Materials for biological applications. 76, p. 810-817Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Shape alteration of large string instruments due to changing climate conditionsBuchelt, B., Dietrich, T., Wagenführ, A., Danczak, M. & Jaschinski, J., Jul 2017, In: European journal of wood and wood products : Holz als Roh- und Werkstoff. 75, 4, p. 561-567, 7 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Symmetry in software synthesisGoens, A., Siccha, S. & Castrillon, J., Jul 2017, In: ACM transactions on architecture and code optimization. 14, 2, 20Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Towards a Standard-Conform, Platform-Generic and Feature-Rich Modelica Device Drivers LibraryThiele, B., Beutlich, T., Waurich, V., Martin, S. & Bellmann, T., Jul 2017, Proceedings oth the 12th International Modelica Conference. p. 713-723, 11 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• ParaDiMe: A distributed memory FPGA router based on speculative parallelism and path encodingHoo, C. H. & Kumar, A., 30 Jun 2017, Proceedings - IEEE 25th Annual International Symposium on Field-Programmable Custom Computing Machines, FCCM 2017. IEEE, New York [u. a.], p. 172-179, 8 p., 7966674Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Experimental investigations on Laser-based hot-melt bonding; Injection molding for Laser-structured metal plastic hybridsAmend, P., Wolf, M., Mrotzek, T., Laumer, T., Roth, S., Gude, M. & Schmidt, M., 29 Jun 2017, Lasers in Manufacturing 2017. 5 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Robust Header Compression version 2 power consumption on Android devices via tunnellingTomoskozi, M., Seeling, P., Ekler, P. & Fitzek, F. H., 29 Jun 2017, 2017 IEEE International Conference on Communications Workshops, ICC Workshops 2017. Papadias, C. B. & Jamalipour, A. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 418-423, 6 p., 7962693Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• A microservice-based architecture approach for the automation of modular process plantsBloch, H., Fay, A., Knohl, T., Hoernicke, M., Bernshausen, J., Hensel, S., Hahn, A. & 1 others, 28 Jun 2017, 2017 22nd IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2017. Institute of Electrical and Electronics Engineers Inc., p. 1-8, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• A proposal for an interactive roundtrip engineering systemRahm, J., Graube, M. & Urbas, L., 28 Jun 2017, 2017 22nd IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2017. Institute of Electrical and Electronics Engineers Inc., p. 1-7, 7 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution