2017

• First Notes on Maximum Entropy Entailment for Quantified ImplicationsKriegel, F., 13 Jun 2017, Formal Concept Analysis : Proceedings of the 14th International Conference on Formal Concept Analysis (ICFCA 2017), Rennes, France. Bertet, K., Borchmann, D., Cellier, P. & Ferré, S. (eds.). Springer, Berlin [u. a.], p. 155-167, 13 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Implications over Probabilistic AttributesKriegel, F., 13 Jun 2017, Formal Concept Analysis: Proceedings of the 14th International Conference on Formal Concept Analysis (ICFCA 2017), Rennes, France. Bertet, K., Borchmann, D., Cellier, P. & Ferré, S. (eds.). Springer, Berlin [u. a.], p. 168-183, 16 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Robust Mapping of Process Networks to Many-Core Systems using Bio-Inspired Design CenteringHempel, G., Goens, A., Castrillón, J., Asmus, J. & Sbalzarini, I. F., 12 Jun 2017, SCOPES '17: Proceedings of the 20th International Workshop on Software and Compilers for Embedded Systems. p. 21-30, 10 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• TETRiS: A multi-application run-time system for predictable execution of static mappingsGoens, A., Khasanov, R., Castrillon, J., Hähnel, M., Smejkal, T. & Härtig, H., 12 Jun 2017, SCOPES '17: Proceedings of the 20th International Workshop on Software and Compilers for Embedded Systems. p. 11-20, 10 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Temporal masking characteristics of whole body vibration perceptionSchwendicke, A., Dou, J. & Altinsoy, M. E., 9 Jun 2017, 2017 IEEE World Haptics Conference (WHC). Wiley-IEEE Press, p. 478-483, 6 p., 7989948Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Access Network Generation for Efficient Debugging of FPGAsKhan, H. U. H., Grimm, T., Hübner, M. & Göhringer, D., 7 Jun 2017, Proceedings of the 8th International Symposium on Highly-Efficient Accelerators and Reconfigurable Technologies, HEART 2017. 6 p., 25Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Measurement strategy of the momentum enhancement beta-factor for near earth object mitigation missionsDelchambre, S., Ziegler, T., Falke, A., Johann, U., Willich, G. & Janschek, K., 7 Jun 2017, 2017 IEEE Aerospace Conference. IEEE Computer Society, 7943905Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• A method to control delaminations in composites for adjusted energy dissipation characteristicsKuhtz, M., Hornig, A., Gude, M. & Jäger, H., 5 Jun 2017, In: Materials and Design. 123, p. 103-111, 9 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• 3D Optical Coupling Techniques on Polymer Waveguides for Wafer and Board Level IntegrationLüngen, S., Charania, S., Tiedje, T., Nieweglowski, K., Killge, S., Lorenz, L., Bartha, J. & 1 others, 2 Jun 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC). IEEE, p. 1612-1618, 7 p., 7999897Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Will Low-Cost 3D Additive Manufactured Packaging Replace the Fan-Out Wafer Level Packages?Tiedje, T., Lüngen, S., Schubert, M., Luniak, M., Nieweglowski, K. & Bock, K., 2 Jun 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC). IEEE, p. 1065-1070, 6 p., 7999817Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution