Publications

2018

• Acquisition of Terminological Knowledge in Probabilistic Description LogicKriegel, F., 24 Sep 2018, KI 2018: Advances in Artificial Intelligence - 41st German Conference on AI, Berlin, Germany, September 24-28, 2018, Proceedings. Trollmann, F. & Turhan, A. (eds.). Berlin, Germany: Springer, Berlin [u. a.], p. 46-53, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Terminological Knowledge Acquisition in Probabilistic Description LogicKriegel, F., 24 Sep 2018Electronic (full-text) versionResearch output: Contribution to conferences > Paper
• Comparative Study of 4H-SiC UV-Sensors with Ion Implanted and Epitaxially Grown p-EmitterMatthus, C. D., Erlbacher, T., Bauer, A. J. & Frey, L., 21 Sep 2018, 2018 22nd International Conference on Ion Implantation Technology (IIT). Institute of Electrical and Electronics Engineers (IEEE), p. 110-113, 4 p., 8807950Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Comparison of Segmented and Traveling-Wave Electro-Optical Transmitters Based on Silicon Photonics Mach-Zehnder ModulatorsGiuglea, A., Belfiore, G., Khafaji, M., Henker, R., Petousi, D., Winzer, G., Zimmermann, L. & 1 others, 21 Sep 2018, Photonics in Switching and Computing (PSC). Institute of Electrical and Electronics Engineers (IEEE), 3 p., 8751239Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Compensation for tool deformation and expansion in virtual try-outs of hot stamping toolsPenter, L., Ihlenfeldt, S. & Pierschel, N., 21 Sep 2018, In: IOP Conference Series: Materials Science and Engineering. 418, 1, 012012Electronic (full-text) versionResearch output: Contribution to journal > Conference article
• Droplet-assisted microfluidic fabrication and characterization of multifunctional polysaccharide microgels formed by multicomponent reactionsHauck, N., Seixas, N., Centeno, S. P., Schlüßler, R., Cojoc, G., Müller, P., Guck, J. & 3 others, 21 Sep 2018, In: Polymers. 10, 10, 1055Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Influences of SMD Package and Substrate Warpage on Quality and Reliability –Measurement, Effects and CounteractionsWohlrabe, H., Meier, K. & Albrecht, O., 21 Sep 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers (IEEE), p. 1-6, 6 p., 8546438Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• In-situ computer tomography for analyzing the effect of voids on the damage behavior of composite materialsProtz, R., Koch, I. & Gude, M., 21 Sep 2018, In: IOP Conference Series: Materials Science and Engineering. 406, 11 p., 012013Electronic (full-text) versionResearch output: Contribution to journal > Conference article
• Measurement of temperature-sensitive electrical parameters of a high-power 4.5 kV IGBT moduleHoeer, M., Meissner, M. & Bernet, S., 21 Sep 2018, 2018 20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe). Institute of Electrical and Electronics Engineers (IEEE), 8515668Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Morphology Variations of Primary Cu6Sn5 Intermetallics in Lead-Free Solder BallsMueller, M., Panchenko, I., Wiese, S. & Wolter, K., 21 Sep 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers (IEEE), p. 1-8, 8 p., 8546391Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution