Publications
The Research Portal (FIS) of TU Dresden provides a detailed search for publications in the School of Engineering Sciences.
22460 Entries
2019
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Scaling Aspects of Nanowire Schottky Junction based Reconfigurable Field Effect Transistors, Apr 2019Electronic (full-text) versionResearch output: Contribution to conferences > Paper
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Self-association of casein studied using enzymatic cross-linking at different temperatures, Apr 2019, In: Food Bioscience. 28, p. 89-98, 10 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
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Special Section “Light Materials − Science and Technology”, Apr 2019, In: Advanced engineering materials. 21, 4, 1900232Electronic (full-text) versionResearch output: Contribution to journal > Editorial (Lead article)
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S-PRAC: Fast Partial Packet Recovery with Network Coding in Very Noisy Wireless Channels, Apr 2019, 2019 Wireless Days, WD 2019. IEEE Computer Society, 8734223Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Growth of regular micro-pillar arrays on steel by polarization-controlled laser interference patterning, 31 Mar 2019, In: Applied Surface Science. 471, p. 1065-1071, 7 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
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Mapping Conformational Changes in a Self-Assembled Two-Dimensional Molecular Network by Statistical Analysis of Conductance Images, 28 Mar 2019, In: Physical review applied. 11, 3, 034070Electronic (full-text) versionResearch output: Contribution to journal > Research article
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A 0.2–18 GHz Schmitt Trigger with up to 13%–85% Duty-Cycle Tuning in 130nm SiGe BiCMOS, 27 Mar 2019, 2019 12th German Microwave Conference (GeMiC). Institute of Electrical and Electronics Engineers (IEEE), p. 107-110, 4 p., 8698127Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Development of a Modular Test Setup for Reliability Testing under Harsh Environment Conditions, 27 Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Institute of Electrical and Electronics Engineers (IEEE), p. 1-5, 5 p., 8724515Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Harmonic Vibration Durability Tests on Lead-Free Solder Joints at Different Isothermal Conditions, 27 Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Institute of Electrical and Electronics Engineers (IEEE), p. 1-5, 5 p., 8724529Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution