Publications

2018

• Teaching in-memory database systems the detection of hardware ErrorsLehner, W., Habich, D. & Kolditz, T., 24 Oct 2018, Proceedings - IEEE 34th International Conference on Data Engineering, ICDE 2018. Institute of Electrical and Electronics Engineers (IEEE), p. 1663, 1 p., 8509424Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• 24 GHz BiCMOS Single-Stage RectifierBrönner, A., Sakalas, P. & Ellinger, F., 23 Oct 2018, Proceedings of the 2018 8th IEEE-APS Topical Conference on Antennas and Propagation in Wireless Communications, APWC 2018. Institute of Electrical and Electronics Engineers (IEEE), p. 870-872, 3 p., 8503746Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• A5G Architecture for the Factory of the FutureLudwig, S., Karrenbauer, M., Fellan, A., Schotten, H. D., Buhr, H., Seetaraman, S., Niebert, N. & 14 others, 22 Oct 2018, Proceedings - 2018 IEEE 23rd International Conference on Emerging Technologies and Factory Automation, ETFA 2018. Institute of Electrical and Electronics Engineers (IEEE), p. 1409-1416, 8 p., 8502642Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• KoMMDia: Dialogue-Driven Assistance System for Fault Diagnosis and Correction in Cyber-Physical Production SystemsRahm, J., Graube, M., Muller, R., Klaeger, T., Schegner, L., Schult, A., Bonse, R. & 3 others, 22 Oct 2018, Proceedings - 2018 IEEE 23rd International Conference on Emerging Technologies and Factory Automation, ETFA 2018. Institute of Electrical and Electronics Engineers (IEEE), p. 999-1006, 8 p., 8502615Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Sandwich structures made of thermoplastics and recycled carbon fibersLuft, J., Troschitz, J., Krahl, M. & Gude, M., 19 Oct 2018, In: Lightweight Design worldwide. 11, p. 20-25, 6 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Thermoplast-Sandwichstrukturen aus recycelten C-FasernLuft, J., Troschitz, J., Krahl, M. & Gude, M., 19 Oct 2018, In: Lightweight Design. 11, p. 20-25, 6 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Tool technology for lightweight structures in 3-D hybrid designsDrössler, R., Waffler, R., Krahl, M. & Haider, D., 19 Oct 2018, In: Lightweight Design worldwide. 11, p. 42-47, 6 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Werkzeugtechnik für Leichtbaustrukturen in 3-D-HybridbauweiseDrössler, R., Waffler, R., Krahl, M. & Haider, D., 19 Oct 2018, In: Lightweight Design. 11, p. 68-73, 6 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Characterization of self-assembled monolayers for Cu-Cu bonding technologyLykova, M., Langer, E., Hinrichs, K., Panchenko, J., Meyer, J., Künzelmann, U., Wolf, M. J. & 1 others, 16 Oct 2018, In: Microelectronic Engineering. 202, p. 19-24, 6 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Numerical modeling of single-step thermoforming of a hybrid metal/FRP lightweight structureZiegs, J., Weck, D., Gude, M. & Kästner, M., 16 Oct 2018Electronic (full-text) versionResearch output: Contribution to conferences > Presentation slides