Publications

2018

• Compensation for tool deformation and expansion in virtual try-outs of hot stamping toolsPenter, L., Ihlenfeldt, S. & Pierschel, N., 21 Sep 2018, In: IOP Conference Series: Materials Science and Engineering. 418, 1, 012012Electronic (full-text) versionResearch output: Contribution to journal > Conference article
• Droplet-assisted microfluidic fabrication and characterization of multifunctional polysaccharide microgels formed by multicomponent reactionsHauck, N., Seixas, N., Centeno, S. P., Schlüßler, R., Cojoc, G., Müller, P., Guck, J. & 3 others, 21 Sep 2018, In: Polymers. 10, 10, 1055Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Influences of SMD Package and Substrate Warpage on Quality and Reliability –Measurement, Effects and CounteractionsWohlrabe, H., Meier, K. & Albrecht, O., 21 Sep 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers (IEEE), p. 1-6, 6 p., 8546438Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• In-situ computer tomography for analyzing the effect of voids on the damage behavior of composite materialsProtz, R., Koch, I. & Gude, M., 21 Sep 2018, In: IOP Conference Series: Materials Science and Engineering. 406, 11 p., 012013Electronic (full-text) versionResearch output: Contribution to journal > Conference article
• Measurement of temperature-sensitive electrical parameters of a high-power 4.5 kV IGBT moduleHoeer, M., Meissner, M. & Bernet, S., 21 Sep 2018, 2018 20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe). Institute of Electrical and Electronics Engineers (IEEE), 8515668Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Morphology Variations of Primary Cu6Sn5 Intermetallics in Lead-Free Solder BallsMueller, M., Panchenko, I., Wiese, S. & Wolter, K., 21 Sep 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers (IEEE), p. 1-8, 8 p., 8546391Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Two-Stage Simulation for Coupling Schemes in the Device Communication using Ray Tracing and Beam Propagation MethodLorenz, L., Nieweglowski, K., Wolter, K. & Bock, K., 21 Sep 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC). Institute of Electrical and Electronics Engineers (IEEE), p. 1-6, 6 p., 8546368Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Enhanced Magnetoresistance in Chiral Molecular JunctionsMaslyuk, V. V., Gutierrez, R., Dianat, A., Mujica, V. & Cuniberti, G., 20 Sep 2018, In: The journal of physical chemistry letters. 9, 18, p. 5453-5459, 7 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Hole Transport in Low-Donor-Content Organic Solar CellsSpoltore, D., Hofacker, A., Benduhn, J., Ullbrich, S., Nyman, M., Zeika, O., Schellhammer, S. & 7 others, 20 Sep 2018, In: Journal of Physical Chemistry Letters. 9, 18, p. 5496-5501Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Online-Kippsicherheitsdiagnose für mobile ArbeitsmaschinenZinke, T. E. & Will, F., 20 Sep 2018, 7. Fachtagung Baumaschinentechnik 2018: Tagungsband. p. 93-112Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution