Publications

2017

• Lightweight floor assembly in multi-material design: Results of the FOREL-Project LEIKAJaschinski, J. & Modler, N., 18 May 2017Research output: Contribution to conferences > Presentation slides
• Efficient hydrogen production on MNi₄ electrocatalysts with fast water dissociation kineticsZhang, J., Wang, T., Liu, P., Liao, Z., Liu, S., Zhuang, X., Chen, M. & 2 others, 17 May 2017, In: Nature communications. 8, 15437Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Numerical fatigue analysis of CFRP componentsKoch, I., Zscheyge, M., Tittmann, K. & Gude, M., 15 May 2017, In: Composite Structures. 168, p. 392-401, 10 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Trading fault tolerance for performance in AN encodingRink, N. A. & Castrillon, J., 15 May 2017, ACM International Conference on Computing Frontiers 2017, CF 2017. Association for Computing Machinery, Inc, p. 183-190, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Abstract: An analysis of LSM caching in NVRAMLersch, L., Oukid, I., Lehner, W. & Schreter, I., 14 May 2017, DAMON '17: Proceedings of the 13th International Workshop on Data Management on New Hardware. Association for Computing Machinery (ACM), New York, 5 p., 9Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Big data causing big (TLB) problems: Taming random memory accesses on the GPUKarnagel, T., Ben-Nun, T., Werner, M., Habich, D. & Lehner, W., 14 May 2017, DAMON '17: Proceedings of the 13th International Workshop on Data Management on New Hardware. Association for Computing Machinery (ACM), New York, 10 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Cu passivation with self-assembled monolayers for direct metal bonding in 3D integrationLykova, M., Panchenko, I., Geidel, M., Reif, J., Wolf, J. M. & Lang, K., 14 May 2017, 2017 40th International Spring Seminar on Electronics Technology (ISSE). Institute of Electrical and Electronics Engineers (IEEE), p. 1-6, 6 p., 8000916Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Fabrication and characterization of precise integrated titanium nitride thin film resistors for 2.5D interposerSingh, R., Boettcher, M., Panchenko, I., Fiedler, C., Schwarz, A. & Wolf, J., 14 May 2017, 2017 40th International Spring Seminar on Electronics Technology (ISSE). Institute of Electrical and Electronics Engineers (IEEE), p. 1-6, 6 p., 8000913Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Influence of flux-assisted isothermal storage on intermetallic compounds in Cu/SnAg microbumpsWambera, L., Panchenko, I., Steller, W., Müller, M. & Wolf, M. J., 14 May 2017, 2017 40th International Spring Seminar on Electronics Technology (ISSE). Institute of Electrical and Electronics Engineers (IEEE), p. 1-6, 6 p., 8000909Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Temperature & pressure correlation for volume of gas hydrates with crystal structures sI & sIIVinš, V., Jäger, A., Hielscher, S., Span, R., Hrubý, J. & Breitkopf, C., 12 May 2017, In: EPJ Web of Conferences. 143, 02141Electronic (full-text) versionResearch output: Contribution to journal > Conference article