Publications

2017

• Temporal masking characteristics of whole body vibration perceptionSchwendicke, A., Dou, J. & Altinsoy, M. E., 9 Jun 2017, 2017 IEEE World Haptics Conference (WHC). Wiley-IEEE Press, p. 478-483, 6 p., 7989948Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Access Network Generation for Efficient Debugging of FPGAsKhan, H. U. H., Grimm, T., Hübner, M. & Göhringer, D., 7 Jun 2017, Proceedings of the 8th International Symposium on Highly-Efficient Accelerators and Reconfigurable Technologies, HEART 2017. 6 p., 25Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Measurement strategy of the momentum enhancement beta-factor for near earth object mitigation missionsDelchambre, S., Ziegler, T., Falke, A., Johann, U., Willich, G. & Janschek, K., 7 Jun 2017, 2017 IEEE Aerospace Conference. IEEE Computer Society, 7943905Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• A method to control delaminations in composites for adjusted energy dissipation characteristicsKuhtz, M., Hornig, A., Gude, M. & Jäger, H., 5 Jun 2017, In: Materials and Design. 123, p. 103-111, 9 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• 3D Optical Coupling Techniques on Polymer Waveguides for Wafer and Board Level IntegrationLüngen, S., Charania, S., Tiedje, T., Nieweglowski, K., Killge, S., Lorenz, L., Bartha, J. & 1 others, 2 Jun 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC). Institute of Electrical and Electronics Engineers (IEEE), p. 1612-1618, 7 p., 7999897Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Will Low-Cost 3D Additive Manufactured Packaging Replace the Fan-Out Wafer Level Packages?Tiedje, T., Lüngen, S., Schubert, M., Luniak, M., Nieweglowski, K. & Bock, K., 2 Jun 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC). Institute of Electrical and Electronics Engineers (IEEE), p. 1065-1070, 6 p., 7999817Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Anisotropic characterization of magnetorheological materialsDohmen, E., Modler, N. & Gude, M., 1 Jun 2017, In: Journal of Magnetism and Magnetic Materials. 431, p. 107-109, 3 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Development of multiaxial warp knitting technology for production of three-dimensional near net shape shell preformsSankaran, V., Rittner, S., Hahn, L. & Cherif, C., 1 Jun 2017, In: Textile research journal. 87, 10, p. 1226-1241, 16 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Measurement uncertainty of non-incremental, non-contact, in-situ shape measurementsSchuster, M. S., Kuschmierz, R. & Czarske, J., 1 Jun 2017, In: Technisches Messen. 84, 6, p. 401-410, 10 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Practical Fixed-Domain Reasoning for Description Logics - Extended AbstractGaggl, S. A., Rudolph, S. & Schweizer, L., 1 Jun 2017, Proceedings of the 11th Alberto Mendelzon International Workshop on Foundations of Data Management and the Web, Montevideo, Uruguay, June 7-9, 2017. Reutter, J. L. & Srivastava, D. (eds.). CEUR-WS.org, (CEUR Workshop Proceedings)Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution