Publications

2017

• Cu passivation with self-assembled monolayers for direct metal bonding in 3D integrationLykova, M., Panchenko, I., Geidel, M., Reif, J., Wolf, J. M. & Lang, K., 14 May 2017, 2017 40th International Spring Seminar on Electronics Technology (ISSE). Institute of Electrical and Electronics Engineers (IEEE), p. 1-6, 6 p., 8000916Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Fabrication and characterization of precise integrated titanium nitride thin film resistors for 2.5D interposerSingh, R., Boettcher, M., Panchenko, I., Fiedler, C., Schwarz, A. & Wolf, J., 14 May 2017, 2017 40th International Spring Seminar on Electronics Technology (ISSE). Institute of Electrical and Electronics Engineers (IEEE), p. 1-6, 6 p., 8000913Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Influence of flux-assisted isothermal storage on intermetallic compounds in Cu/SnAg microbumpsWambera, L., Panchenko, I., Steller, W., Müller, M. & Wolf, M. J., 14 May 2017, 2017 40th International Spring Seminar on Electronics Technology (ISSE). Institute of Electrical and Electronics Engineers (IEEE), p. 1-6, 6 p., 8000909Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Temperature & pressure correlation for volume of gas hydrates with crystal structures sI & sIIVinš, V., Jäger, A., Hielscher, S., Span, R., Hrubý, J. & Breitkopf, C., 12 May 2017, In: EPJ Web of Conferences. 143, 02141Electronic (full-text) versionResearch output: Contribution to journal > Conference article
• Accounting for systematic errors in approximate computingBruestel, M. & Kumar, A., 11 May 2017, Proceedings of the 2017 Design, Automation and Test in Europe, DATE 2017. Lausanne: Institute of Electrical and Electronics Engineers (IEEE), p. 298-301, 4 p., 7927003Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Embracing approximate computing for energy-efficient motion estimation in high efficiency video codingEl-Harouni, W., Rehman, S., Prabakaran, B. S., Kumar, A., Hafiz, R. & Shafique, M., 11 May 2017, Design, Automation & Test in Europe Conference & Exhibition (DATE), 2017. Lausanne: Institute of Electrical and Electronics Engineers (IEEE), p. 1384-1389, 6 p., 7927209Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Rethinking on-chip DRAM cache for simultaneous performance and energy optimizationHameed, F. & Castrillon, J., 11 May 2017, Design, Automation & Test in Europe Conference & Exhibition (DATE), 2017. Lausanne: Institute of Electrical and Electronics Engineers (IEEE), p. 362-367, 6 p., 7927017Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• SecureCloud: Secure big data processing in untrusted cloudsKelbert, F., Gregor, F., Pires, R., Kopsell, S., Pasin, M., Havet, A., Schiavoni, V. & 3 others, 11 May 2017, Proceedings of the 2017 Design, Automation and Test in Europe, DATE 2017. Lausanne: Institute of Electrical and Electronics Engineers (IEEE), p. 282-285, 4 p., 7926999Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Soft error-aware architectural exploration for designing reliability adaptive cache hierarchies in multi-coresSubramaniyan, A., Rehman, S., Shafique, M., Kumar, A. & Henkel, J., 11 May 2017, Design, Automation & Test in Europe Conference & Exhibition (DATE), 2017. Lausanne: Institute of Electrical and Electronics Engineers (IEEE), p. 37-42, 6 p., 7926955Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Accelerated life time measurement with in-situ force and displacement monitoring during thermal cycling on solder jointsMetasch, R., Roellig, M., Kuczynska, M., Schafet, N., Becker, U., Meier, K. & Panchenko, I., 10 May 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. Institute of Electrical and Electronics Engineers (IEEE), 7926287Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution