Publications
The Research Portal (FIS) of TU Dresden provides a detailed search for publications in the School of Engineering Sciences.
19362 Entries
2015
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Low-cycle fatigue behaviour of polyamides , Nov 2015, In: Fatigue & Fracture of Engineering Materials & Structures. 38, 11, p. 1383-1394Electronic (full-text) versionResearch output: Contribution to journal > Conference article
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Radio frequency electronics on plastic , Nov 2015, SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference (IMOC) 2015. 5 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Sollbahnberechnung zur Impulskompensation eines linearmotorgetriebenen Kreuzschlittens , Nov 2015, p. 171-184, 14 p.Research output: Contribution to conferences > Paper
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Textile Loop Antenna and TFT Channel-Select Circuit for Fully Bendable TFT Receivers , Nov 2015, SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference (IMOC) 2015. 5 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Worst-case secrecy rates in MIMOME systems under input and state constraints , Nov 2015, Proceedings of the IEEE International Workshop on Information Forensics and Security (WIFS). Rome, Italy, p. 1-6Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Thermoelectric properties of functionalized graphene grain boundaries , 30 Oct 2015, In: Journal of Self-Assembly and Molecular Electronics (SAME). 3, 1, p. 1–20Electronic (full-text) versionResearch output: Contribution to journal > Research article
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A novel control scheme for medium voltage drives operated by optimized pulse patterns , 29 Oct 2015, 2015 IEEE Energy Conversion Congress and Exposition (ECCE). p. 4488-4495, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Electrical behaviour of Flip-Chip bonded thin silicon chip-on-foil assembly during bending , 25 Oct 2015, 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME). Institute of Electrical and Electronics Engineers (IEEE), p. 367-372, 6 p., 7342355Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Electrodeposition of Co-Mn3O4 composite coatings , 25 Oct 2015, In: Surface & coatings technology. 280, p. 208-215, 8 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
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Back-Transformation into Physical Configuration Space after Model Order Reduction onto a General Subspace , 21 Oct 2015, Special Issue:86th Annual Meeting of the International Association of Applied Mathematics and Mechanics (GAMM). Zavarise, G., Cinnella, P. & Campiti, M. (eds.).Vol. Volume 15, Issue 1. p. 61-62Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution