Publications

2026

• Timestamp-Based Quantum Key DistributionWang, Y., Nande, S. S., Bassoli, R. & Fitzek, F. H., Jul 2026, IEEE Globecom Workshops, GC Wkshps. p. 2252-2257, 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Torsion testing of spot welds: influence of the sheet thickness and the test ratesMathiszik, C., Heilmann, S., Koal, J., Füssel, U. & Schmale, H. C., Jul 2026, In: Welding in the world. 70, 7, p. 2863-2875, 13 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Volumetric Near-Field Beamfocusing via Zernike Phase TaperingParvini, M., Banerjee, B., Loss, B., Nimr, A. & Fettweis, G., Jul 2026, ICC 2026 - IEEE International Conference on Communications, Proceedings. Institute of Electrical and Electronics Engineers (IEEE)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• XChain: Multi-Stage Traffic Analysis and Classification in O-RANDuong, B. V., Doan, T. V., Attawna, M., Fitzek, F. H. & Nguyen, G. T., Jul 2026, 2026 IEEE 12th International Conference on Network Softwarization: Autonomous and Reliable Softwarized Networks in the Age of Distributed Intelligence, NetSoft 2026 - Proceedings. Chemouil, P., Schmid, S., Fajjari, I., Haque, I., Mattos, D., Borsatti, D. & Parzyjegla, H. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 321-326, 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• HONOR: O-RAN-compliant Handover Optimization in Vehicular Networks via Offline RLWang, Y., Yang, Y., Ma, M., Attawna, M., Fitzek, F. H. & Nguyen, G. T., 30 Jun 2026, 2026 IFIP Networking Conference, IFIP Networking 2026. Institute of Electrical and Electronics Engineers (IEEE)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Microstructure modeling and computational micromechanics of glued metallic hollow-sphere compositesJabs, L., Zhou, X., Penter, L., Ihlenfeldt, S. & Schneider, M., 29 Jun 2026, In: Archive of applied mechanics. 96, 7, 27 p., 141Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Potentials of dry pulped lignocellulose fibers for a semi-dry paper making processLoist, M. & Kleinert, R., 29 Jun 2026Research output: Contribution to conferences > Poster
• A Data‐Driven Multiscale Scheme for Anisotropic Finite Strain Magneto‐ElasticityRoth, H. T., Gebhart, P., Kalina, K. A., Wallmersperger, T. & Kästner, M., 26 Jun 2026, In: International journal for numerical methods in engineering. 127, 12, 32 p., e70367Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Datasets on the mechanical behavior of rotary-cut veneer under tensile, compressive, and shear loadingKrüger, R., Buchelt, B., Zauer, M. & Wagenführ, A., 26 Jun 2026, In: Scientific data. 13, 1, 937Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Large-Area 2D Metasurface-Based Triboelectric E-Skin Arrays: Contact & Proximity Tactile Mapping with Broadband Acoustic ReadoutsArief, I., Sarkar, S., Ghosh, A. K., Verners, O., Meena, K. K., Lee, S. H., Chae, S. & 6 others, 26 Jun 2026, In: Advanced materials. 38, 36, e21525Electronic (full-text) versionResearch output: Contribution to journal > Research article