Publications

2017

• Towards a Standard-Conform, Platform-Generic and Feature-Rich Modelica Device Drivers LibraryThiele, B., Beutlich, T., Waurich, V., Martin, S. & Bellmann, T., Jul 2017, Proceedings oth the 12th International Modelica Conference. p. 713-723, 11 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• ParaDiMe: A distributed memory FPGA router based on speculative parallelism and path encodingHoo, C. H. & Kumar, A., 30 Jun 2017, Proceedings - IEEE 25th Annual International Symposium on Field-Programmable Custom Computing Machines, FCCM 2017. Institute of Electrical and Electronics Engineers (IEEE), p. 172-179, 8 p., 7966674Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Experimental investigations on Laser-based hot-melt bonding; Injection molding for Laser-structured metal plastic hybridsAmend, P., Wolf, M., Mrotzek, T., Laumer, T., Roth, S., Gude, M. & Schmidt, M., 29 Jun 2017, Lasers in Manufacturing 2017. 5 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Robust Header Compression version 2 power consumption on Android devices via tunnellingTomoskozi, M., Seeling, P., Ekler, P. & Fitzek, F. H., 29 Jun 2017, 2017 IEEE International Conference on Communications Workshops, ICC Workshops 2017. Papadias, C. B. & Jamalipour, A. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 418-423, 6 p., 7962693Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• A microservice-based architecture approach for the automation of modular process plantsBloch, H., Fay, A., Knohl, T., Hoernicke, M., Bernshausen, J., Hensel, S., Hahn, A. & 1 others, 28 Jun 2017, 2017 22nd IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2017. Institute of Electrical and Electronics Engineers (IEEE), p. 1-8, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• A proposal for an interactive roundtrip engineering systemRahm, J., Graube, M. & Urbas, L., 28 Jun 2017, 2017 22nd IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2017. Institute of Electrical and Electronics Engineers (IEEE), p. 1-7, 7 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• HAZOP studies for engineering safe modular process plantsPfeffer, A. & Urbas, L., 28 Jun 2017, 2017 22nd IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2017. Institute of Electrical and Electronics Engineers (IEEE), p. 1-4, 4 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Information models in OPC UA and their advantages and disadvantagesGraube, M., Hensel, S., Iatrou, C. & Urbas, L., 28 Jun 2017, 2017 22nd IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2017. Institute of Electrical and Electronics Engineers (IEEE), p. 1-8, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Generating what-if scenarios for time series dataKegel, L., Hahmann, M. & Lehner, W., 27 Jun 2017, SSDBM 2017: 29th International Conference on Scientific and Statistical Database Management. Association for Computing Machinery (ACM), 12 p., 3Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Hardware Based DatabasesLehner, W., 27 Jun 2017, In: Information technology : methods and applications of informatics and information technology. 59, 3, p. 107-108, 2 p., 3Electronic (full-text) versionResearch output: Contribution to journal > Editorial (Lead article)