2014

• Modeling communication delays for network coding and routing for error-prone transmissionPfennig, S., Franz, E., Ciorba, F. M., Ilsche, T. & Nagel, W. E., 1 Aug 2014, Third International Conference on Future Generation Communication Technologies (FGCT 2014). Wiley-IEEE PressElectronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Preparation of melt-spun antimicrobially modified LDH/polyolefin nanocomposite fibersKutlu, B., Schröttner, P., Leuteritz, A., Boldt, R., Jacobs, E. & Heinrich, G., 1 Aug 2014, In: Materials Science and Engineering: C, Materials for biological applications. 41, p. 8-16, 9 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Röntgen-Computer-Tomographie im LeichtbauUllrich, H., Hufenbach, W., Gude, M., Modler, N., Danczak, M., Geske, V. & Radloff, S., 1 Aug 2014, In: The e-journal of nondestructive testing & ultrasonics. 19, 8, 17 p.Electronic (full-text) versionResearch output: Contribution to journal > Conference article
• IVC in Cities: Signal Attenuation by Buildings and How Parked Cars Can Improve the SituationSommer, C., Eckhoff, D. & Dressler, F., Aug 2014, In: IEEE Transactions on Mobile ComputingElectronic (full-text) versionResearch output: Contribution to journal > Research article
• Regime transition in viscous and pseudo viscous systems: A comparative studyRabha, S., Schubert, M. & Hampel, U., Aug 2014, In: AIChE Journal. 60, 8, p. 3079-3090, 12 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Near surface inversion layer recombination in Al₂O₃ passivated n -type siliconDirnstorfer, I., Simon, D. K., Jordan, P. M. & Mikolajick, T., 28 Jul 2014, In: Journal of applied physics. 116, 4, 044112Electronic (full-text) versionResearch output: Contribution to journal > Research article
• On configuration flatness of linear mechanical systemsKnoll, C. & Röbenack, K., 22 Jul 2014, 2014 European Control Conference (ECC). Strasbourg: Institute of Electrical and Electronics Engineers (IEEE), p. 1416-1421, 6 p., 6862306Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Backside Thinning and Stress-Relief Techniques for Thin Silicon WafersLandesberger, C., Paschke, C., Spöhrle, H. P. & Bock, K., 21 Jul 2014, 3D Process Technology. Wiley-Blackwell, Berlin, Vol. 3. p. 207-226, 20 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report
• High-Accuracy Self-Alignment of Thin Silicon Dies on Plasma-Programmed SurfacesLandesberger, C., Hiroshima, M., Weber, J. & Bock, K., 21 Jul 2014, 3D Process Technology. Wiley-Blackwell, Berlin, Vol. 3. p. 335-344, 10 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report
• Impedimetric fiber-sensors for wound monitoringSchröter, A., Wendler, J., Nocke, A., Cherif, C., Gerlach, G. & Rösen-Wolff, A., 17 Jul 2014, Sensors and Measuring Systems 2014: 17. ITG/GMA Symposium. VDE Verlag, Berlin [u. a.], 5 p.Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution