Publications
The Research Portal (FIS) of TU Dresden provides a detailed search for publications in the School of Engineering Sciences.
20788 Entries
2014
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Innovative Leichtbaulösungen als Schlüssel zur Standortstärkung, 2014, In: Kunststoffe. 104, 9, p. 26-29, 4 p.Electronic (full-text) versionResearch output: Contribution to journal > Meeting abstract
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In-situ DRIFT spectroscopy study to investigate gas sorption on sulfated zirconias, 2014Research output: Contribution to conferences > Poster
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In-Situ Investigations of Individual Nanowires within a FIB/SEM System, 2014, Microscopy and Microanalysis. Vol. 20. p. 360-361, 2 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Integral manufacture of fiber-reinforced sandwich structures with cellular core using a polyurethane spray coat method, 2014Research output: Contribution to conferences > Presentation slides
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Integral manufacture of novel sandwich structures using a polyurethane spray coat method, 2014Research output: Contribution to conferences > Presentation slides
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Integrated Virtual Commissioning - an essential activity in the Automation Engineering Process: From virtual commissioning to simulation supported engineering, 2014, Proceedings of the 40th Annual Conference of the IEEE Industrial Electronics Society. IEEE Industrial Electronics SocietyElectronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Integriertes System- und Dienste-Management: Ein Weg zur verbesserten Informationssicherheit, 2014, Industrielle Informationssicherheit : IT in der Automation. Urbas, L. (ed.).p. 54–60, 7 p., 54Research output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report
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Interconnect Planning for Physical Design of 3D Integrated Circuits, 2014, Düsseldorf: VDI Verlag, Düsseldorf, 139 p.Research output: Book/Report/Anthology > Monograph
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Interfacekonzepte für AR-/VR-Szenarien mit der Oculus Rift, 2014Research output: Contribution to conferences > Paper
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Interflex: Challenges and solutions to fabricate a double-sided wiring layer for a “system in foil”, 2014, Smart Systems Integration - 8th International Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components, SSI 2014. Gessner, T. (ed.). Apprimus Verlag, p. 131-138, 8 p.Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution