2023

• Wasserstoff: Ortho/Para-Umwandlung und VerflüssigungHaberstroh, C., 12 Dec 2023, In: Chemie-Ingenieur-Technik. 96, 1-2, p. 43-54, 12 p.Electronic (full-text) versionResearch output: Contribution to journal > Review article
• Application and evaluation of classic and demand oriented cooling strategies in context of machine toolsWenkler, E., Steiert, C., Ihlenfeldt, S. & Weber, J., 11 Dec 2023, In: The International Journal of Advanced Manufacturing Technology. 130 (2024), 3-4, p. 1451-1463, 13 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Feasibility and Optimisation of Cu-Sintering under Nitrogen AtmosphereMeyer, J., Gierth, K. F. W., Meier, K. & Bock, K., 8 Dec 2023, Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023. Tay, A., Chui, K. J., Lim, Y. K., Tan, C. S. & Shin, S. (eds.). IEEE, p. 569-573, 5 p., 10457721Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Improvement in Wafer-to-Wafer Hybrid Bonding Using Optimized Chemical Mechanical Planarization Process for Cu DishingKhurana, G. & Panchenko, I., 8 Dec 2023, 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC). Tay, A., Chui, K. J., Lim, Y. K., Tan, C. S. & Shin, S. (eds.). IEEE, p. 373-380, 8 p., 10457774Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Study on Using Noisy Synthetic Data for Neural Networks to Assess Thermo-Mechanical Reliability Parameters of Solder InterconnectsAlbrecht, O., Höhne, R. D. J., Barkur, D., Meier, K. & Bock, K., 8 Dec 2023, Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023. Tay, A., Chui, K. J., Lim, Y. K., Tan, C. S. & Shin, S. (eds.). IEEE, p. 751-756, 6 p., 10457730Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Temperature-dependent Creep Characterization of Lead-free Solder Alloys Using Nanoindentation for Finite Element ModelingDudash, V., Machani, K. V., Meier, K., Geisler, H., Mueller, M., Kuechenmeister, F., Wieland, M. & 1 others, 8 Dec 2023, Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023. Tay, A., Chui, K. J., Lim, Y. K., Tan, C. S. & Shin, S. (eds.). IEEE, p. 757-763, 7 p., 10457727Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Feature causalityDubslaff, C., Weis, K., Baier, C. & Apel, S., 7 Dec 2023, In: Journal of Systems and Software. 209 (2024), 19 p., 111915Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Tailoring of thermomagnetic properties in Ni-Mn-Ga films through Cu additionFink, L., Nielsch, K. & Fähler, S., 5 Dec 2023, In: Journal of alloys and compounds. 966, 171435Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Uncertainty analysis of gamma-ray densitometry applied for gas flow modulation technique in bubble columnsMarchini, S., Bieberle, A., Schubert, M. & Hampel, U., 5 Dec 2023, In: Chemical engineering science. 282, 119214Electronic (full-text) versionResearch output: Contribution to journal > Research article
• A Last-Level Defense for Application Integrity and ConfidentialityPereira Fernandez, G., Brito, A., Hartono, A. P. P., Sardar, M. U. & Fetzer, C., 4 Dec 2023, 10 p.Electronic (full-text) versionResearch output: Contribution to conferences > Paper