Publications

2024

• Analysis of Electronic Modules for Construction Machines and Development of a Reliability Test MethodHäusler, M., Meier, K. & Bock, K., 19 May 2024, 2024 47th International Spring Seminar on Electronics Technology (ISSE). Institute of Electrical and Electronics Engineers (IEEE), Vol. 2024. p. 1-5, 5 p., 10603578Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Development of Computationally Efficient Numerical Models for Assessing the Reliability of Electronic Components under Vibration LoadsLyu, C., Meier, K. & Bock, K., 19 May 2024, 2024 47th International Spring Seminar on Electronics Technology (ISSE). Institute of Electrical and Electronics Engineers (IEEE), Vol. 2024. p. 1-6, 6 p., 10603965Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Evaluation of semipermeable membranes for encapsulating gas sensors in human intestinal environmentsStadermann, F., Köst, V. C., Nieweglowski, K., Meier, K. & Bock, K., 19 May 2024, 2024 47th International Spring Seminar on Electronics Technology (ISSE). Institute of Electrical and Electronics Engineers (IEEE), p. 1-4, 4 p., 10603601Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• AI for Inclusive Learning in Higher Education: Diversity, Accessibility, and Mental HealthLoitsch, C. & Striegl, J., 16 May 2024, Die Rehabilitationstechnologie im Wandel: Eine Mensch-Technik-Umwelt Betrachtung. Heitplatz, V. & Wilkens, L. (eds.). Technische Universität Dortmund, p. 595-612, 18 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report
• Deep Learning verringert den Aufwand bei der Bestimmung von Materialkennwerten in Faser-Kunststoff-VerbundenGerritzen, J., Hornig, A., Winkler, P. & Gude, M., 16 May 2024Research output: Contribution to conferences > Presentation slides
• Towards a process for the creation of synthetic training data for AI-computer vision models utilizing engineering dataSchwoch, S., Dammann, M. P., Bartl, J. G., Kretzschmar, M., Saske, B. & Paetzold-Byhain, K., 16 May 2024, In: Proceedings of the Design Society. 4, p. 2237-2246, 10 p.Electronic (full-text) versionResearch output: Contribution to journal > Conference article
• Towards a seamless data cycle for space components: considerations from the growing European future digital ecosystem Gaia-XSeidel, A., Wenzel, K., Hänel, A., Teicher, U., Weiß, A., Schäfer, U., Ihlenfeldt, S. & 2 others, 16 May 2024, In: CEAS space journal. 16 (2024), 3, p. 351-365, 15 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Electronic quantum wires in extended quasiparticle pictureMorawetz, K., Ashokan, V., Pathak, K. N., Drummond, N. & Cuniberti, G., 15 May 2024, In: Physical Review B. 109, 20, 205116Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Entwicklung einer Prozesskette zur Erstellung optimaler Machine-Learning-Modelle für die Regression von FormzahlenTunsch, P., Becker, N. & Schlecht, B., 15 May 2024, Dresdner Maschinenelemente Kolloquium DMK 2024. Schlecht, B. (ed.).p. 483 - 501Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Generation of Digital Twins for Exchanging Information via Application Programming InterfacesBraunisch, N., Ristin-Kaufmann, M., Schmidt, U., Lehmann, R., Wollschlaeger, M. & Venn, H. W. V. D., 15 May 2024, 2024 IEEE 7th International Conference on Industrial Cyber-Physical Systems (ICPS). Institute of Electrical and Electronics Engineers (IEEE), p. 1-6, 6 p., 10639996Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution