2010

• EMI Camera LSI (EMcam) with 12 × 4 on-chip loop antenna matrix in 65-nm CMOS to measure EMI noise distribution with 60-µm spatial precisionMasunaga, N., Ishida, K., Takamiya, M. & Sakurai, T., 22 Sep 2010, IEEE Custom Integrated Circuits Conference 2010. IEEE, p. 1-4, 4 p., 5617413Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Failure mechanism of solder interconnections under thermal cycling conditionsMattila, T. T., Mueller, M., Paulasto-Kröckel, M. & Wolter, K., 16 Sep 2010, 3rd Electronics System Integration Technology Conference ESTC. IEEE, p. 1-8, 8 p., 5642843Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Impact of thermal aging on the thermal fatigue durability of Pb-free solder jointsChauhan, P., Mueller, M., Osterman, M. & Pecht, M., 16 Sep 2010, 3rd Electronics System Integration Technology Conference ESTC. IEEE, p. 1-10, 10 p., 5642908Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Influence of metallographic preparation on EBSD characterization of Cu wire bondsTkachenko, A., Mueller, M., Zerna, T. & Wolter, K., 16 Sep 2010, 3rd Electronics System Integration Technology Conference ESTC. IEEE, p. 1-5, 5 p., 5642846Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Influence of nano silver filler content on properties of ink-jet printed structures for microelectronicsFalat, T., Felba, J., Moscicki, A., Smolarek, A., Bock, K. & Bonfert, D., 16 Sep 2010, 3rd Electronics System Integration Technology Conference ESTC. IEEE, p. 1-5, 5 p., 5642899Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• The scaling effect on microstructure and creep properties of Sn-based soldersWiese, S., Mueller, M., Panchenko, I., Metasch, R., Roellig, M. & Wolter, K., 16 Sep 2010, 3rd Electronics System Integration Technology Conference ESTC. IEEE, p. 1-8, 8 p., 5642825Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Experimentally based strategy for damage analysis of textile-reinforced composites under static loadingBöhm, R. & Hufenbach, W., 15 Sep 2010, In: Composites Science and Technology. 70, 9, p. 1330-1337, 8 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• A Rule-Based Language for Complex Event Processing and ReasoningAnicic, D., Fodor, P., Rudolph, S., Stühmer, R., Stojanovic, N. & Studer, R., 1 Sep 2010, Web Reasoning and Rule Systems - Fourth International Conference. Hitzler, P. & Lukasiewicz, T. (eds.). Springer, Berlin [u. a.], p. 42-57, 16 p., (LNCS)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• cf2 Semantics RevisitedGaggl, S. A. & Woltran, S., 1 Sep 2010, Proceedings of the Third International Conference on Computational Models of Argument (COMMA 2010). Baroni, P., Cerutti, F., Giacomin, M. & Simari, G. R. (eds.). IOS Press, Amsterdam [u. a.], Vol. 216. p. 243-254, 12 p., (Frontiers in Artificial Intelligence and Applications)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Efficient compensation of delay variations in high-speed network-on-chip data linksHöppner, S., Walter, D., Eisenreich, H. & Schüffny, R., 1 Sep 2010, IEEE International Symposium on System on Chip (SoC). p. 55-58, 4 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution