2010

• Osseointegration of titanium prostheses on the stapes footplateNeudert, M., Beleites, T., Ney, M., Kluge, A., Lasurashvili, N., Bornitz, M., Scharnweber, D. & 1 others, Jun 2010, In: Journal of the Association for Research in Otolaryngology : JARO. 11, 2, p. 161-71, 11 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Titan im AutomobilbauPeters, M. & Leyens, C., Jun 2010, In: Metall. 64, 6, p. 292-295, 4 p.Research output: Contribution to journal > Research article
• Plastic anisotropy of ultrafine grained aluminium alloys produced by accumulative roll bondingBeausir, B., Scharnweber, J., Jaschinski, J., Brokmeier, H., Oertel, C. & Skrotzki, W., 25 May 2010, In: Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing. 527, 13-14, p. 3271-3278, 8 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Microstructural analysis of reballed tin-lead, lead-free, and mixed ball grid array assemblies under temperature cycling testNie, L., Mueller, M., Osterman, M. & Pecht, M., 18 May 2010, In: Journal of electronic materials. 39, 8, p. 1218-1232, 15 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Influence of metallographic preparation on electron backscatter diffraction characterization of copper wire bondsTkachenko, A., Mueller, M., Zerna, T. & Wolter, K., 16 May 2010, 33rd International Spring Seminar on Electronics Technology, ISSE 2010. IEEE, p. 50-54, 5 p., 5547258Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Metallographic preparation of the SnAgCu solders for optical microscopy and EBSD InvestigationsPanchenko, I., Mueller, M. & Wolter, K., 16 May 2010, 33rd International Spring Seminar on Electronics Technology, ISSE 2010. IEEE, p. 18-23, 6 p., 5547252Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Polymer electronics towards system integrationBonfert, D., Klink, G. & Bock, K., 16 May 2010, 33rd International Spring Seminar on Electronics Technology, ISSE 2010. IEEE, p. 1-6, 6 p., 5547248Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Influence of shot peening on notched fatigue strength of the high-strength wrought magnesium alloy AZ80Zhang, P., Lindemann, J. & Leyens, C., 14 May 2010, In: Journal of alloys and compounds. 497, 1-2, p. 380-385, 6 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Investigations of fast-rotating bodies using an interferometric laser-doppler distance sensor systemGünther, P., Dreier, F., Pfister, T., Czarske, J., Haupt, T., Gude, M. & Hufenbach, W., 14 May 2010, Optical Micro- and Nanometrology III. 10 p., 771819Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Roll-to-roll hot embossing of microstructuresVelten, T., Bauerfeld, F., Schuck, H., Scherbaum, S., Landesberger, C. & Bock, K., 7 May 2010, 2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP). IEEE, p. 326-331, 6 p., 5486475Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution