Publications
The Research Portal (FIS) of TU Dresden provides a detailed search for publications in the School of Engineering Sciences.
19634 Entries
2011
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Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu diffusion barriers by means of bias temperature stress measurements , May 2011, In: Microelectronic Engineering. 88, 5, p. 641-645, 5 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
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Control of Thermal and Electronic Transport in Defect-Engineered Graphene Nanoribbons , May 2011, In: ACS Nano. 5, 5, p. 3779-3787, 9 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
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Development of a SIMPACK User Routine for Dynamic Light Rail Vehicle Gauging Simulations , May 2011Research output: Contribution to conferences > Paper
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Effiziente Energierekuperation in Kranen durch Supercaps , May 2011Research output: Contribution to conferences > Paper
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Strain rate dependent low velocity impact response of layerwise 3d-reinforced composite structures , May 2011, In: International Journal of Impact Engineering. 38, 5, p. 358-368, 11 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
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Traffic information systems: efficient message dissemination via adaptive beaconing , May 2011, In: IEEE communications magazineElectronic (full-text) versionResearch output: Contribution to journal > Research article
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Transport response of carbon-based resonant cavities under time-dependent potential and magnetic fields , May 2011, In: Europhysics Letters. 94, 4, 6 p., 47002Electronic (full-text) versionResearch output: Contribution to journal > Research article
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Vorab-Sollwertberechnung für die Impulskompensation von Lineardirektantrieben , May 2011, In: Zeitschrift fuer Wirtschaftlichen Fabrikbetrieb : ZWF. 106, 5, p. 352-356, 5 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
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Zum Schwingungsverhalten der Laute: Analysis and Description of Music Instruments using Engineering Methods , May 2011Research output: Contribution to conferences > Paper
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The creep behaviour and microstructure of ultra small solder joints , 20 Apr 2011, 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Institute of Electrical and Electronics Engineers (IEEE), p. 1-6, 6 p., 5765827Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution