Publications

2013

• Grain size evolution simulation in aluminium alloys AA 6082 and AA 7020 during hot forward extrusion processFoydl, A., Segatori, A., Ben Khalifa, N., Donati, L., Brosius, A., Tomesani, L. & Tekkaya, A. E., 2013, In: Materials Science and Technology. 29, 1, p. 100-110Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Großwärmespeicher zum Lastmanagement und zur Einbindung von UmweltenergieGroß, S., Rhein, M. & Rühling, K., 2013, In: Euroheat and Power/Fernwarme International. 42, 6, p. 42-48Research output: Contribution to journal > Research article
• Hafnium oxide based CMOS compatible ferroelectric materialsSchroeder, U., Mueller, S., Mueller, J., Yurchuk, E., Martin, D., Adelmann, C., Schloesser, T. & 2 others, 2013, In: ECS Journal of Solid State Science and Technology. 2, 4, N69Electronic (full-text) versionResearch output: Contribution to journal > Research article
• HEMT test structure technology for fast on-wafer characterization of epitaxial GaN-on-Si materialSchuster, M., Wachowiak, A., Szabo, N., Jahn, A., Merkel, U., Ruf, A., Mikolajick, T. & 4 others, 2013, 2013 IEEE International Semiconductor Conference Dresden - Grenoble: Technology, Design, Packaging, Simulation and Test, ISCDG 2013. 6656315Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Herausforderungen für die Gestaltung von zukunftsfähigen ERP-SystemenLambeck, C. & Fohrholz, C., 2013Research output: Contribution to conferences > Paper
• Herausforderung für das Einbringen der Klebtechnik in einen bestehenden Fertigungsprozess in einem mittelständischen UnternehmenSchlegel, D., Karadschow, I., Flemming, V., Füssel, U. & Kleinert, H., 2013Research output: Contribution to conferences > Paper
• Heterointegration technologies for high frequency modules based on film substratesBock, K., Yacoub-George, E., Wolf, H., Landesberger, C., Klink, G. & Gieser, H., 2013, 2013 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2013. CS MANTECH, p. 319-322, 4 p.Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Hierarchical Memory Buffering Techniques for an In-Memory Event Tracing Extension to the Open Trace Format 2Wagner, M., Knuepfer, A. & Nagel, W. E., 2013, International Conference on Parallel Processing (ICPP). p. 970-976, 7 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Highly sensitive time-resolved thermography and multivariate image analysis of the cerebral cortex for intrasurgical diagnosticsHollmach, J., Hoffmann, N., Schnabel, C., Küchler, S., Sobottka, S., Kirsch, M., Schackert, G. & 2 others, 2013, Photonic Therapeutics and Diagnostics IX. 856550Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• High-temperature stability of laser-joined silicon carbide componentsHerrmann, M., Lippmann, W. & Hurtado, A., 2013, In: Journal of Nuclear MaterialsResearch output: Contribution to journal > Research article