Publications
The Research Portal (FIS) of TU Dresden provides a detailed search for publications in the School of Engineering Sciences.
19349 Entries
2010
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A 60% higher write speed, 4.2gbps, 24-channel 3D-Solid State Drive (SSD) with NAND flash channel number detector and intelligent program-voltage booster , 18 Jun 2010, 2010 Symposium on VLSI Circuits. Institute of Electrical and Electronics Engineers (IEEE), p. 233-234, 2 p., 5560284Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Europäisches Forschungszentrum für Mg-Legierungen und Erzeugungsverfahren , 18 Jun 2010Research output: Contribution to conferences > Presentation slides
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Prozessintegrierte Piezokeramik-Sensorik und -Aktorik für Faser-Kunststoff-Verbunde , 18 Jun 2010Research output: Contribution to conferences > Presentation slides
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SIMOTEX – Praxisgerechte Simulationsmodelle zur virtuellen Entwicklung neuartiger Textilverbundwerkstoffe für Crash- und Impactanwendungen unter Berücksichtigung von Mikro-Meso-Makro-Interaktionen , 17 Jun 2010Research output: Contribution to conferences > Presentation slides
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Auslegung und Konstruktion der Maschinentechnik von Windenergieanlagen unter Berücksichtigung der besonderen Betriebsanforderungen , 8 Jun 2010, VDI Wissensforum – TechnikforumResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Osseointegration of titanium prostheses on the stapes footplate , Jun 2010, In: Journal of the Association for Research in Otolaryngology : JARO. 11, 2, p. 161-71, 11 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
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Titan im Automobilbau , Jun 2010, In: Metall. 64, 6, p. 292-295, 4 p.Research output: Contribution to journal > Research article
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Plastic anisotropy of ultrafine grained aluminium alloys produced by accumulative roll bonding , 25 May 2010, In: Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing. 527, 13-14, p. 3271-3278, 8 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
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Microstructural analysis of reballed tin-lead, lead-free, and mixed ball grid array assemblies under temperature cycling test , 18 May 2010, In: Journal of electronic materials. 39, 8, p. 1218-1232, 15 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
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Influence of metallographic preparation on electron backscatter diffraction characterization of copper wire bonds , 16 May 2010, 33rd International Spring Seminar on Electronics Technology, ISSE 2010. Institute of Electrical and Electronics Engineers (IEEE), p. 50-54, 5 p., 5547258Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution