2025

• How to Use the Osteoclast Identifier SoftwareLv, G., Wiesmann, H. & Kruppke, B., 11 April 2025, in: Applied sciences. 15, 8, 4208Elektronische (Volltext-)VersionPublikation: Beitrag in Fachzeitschrift > Forschungsartikel
• Solving Robust Markov Decision Processes: Generic, Reliable, EfficientMeggendorfer, T., Weininger, M. & Wienhöft, P., 11 April 2025, in: Proceedings of the AAAI Conference on Artificial Intelligence. 39, 25, S. 26631-26641, 11 S.Elektronische (Volltext-)VersionPublikation: Beitrag in Fachzeitschrift > Konferenzartikel
• Artificial Intelligence for Image-Based Identification of Osteoclasts and Assessment of Their Maturation—Using the OC_IdentifierLv, G., Heinemann, C., Wiesmann, H. & Kruppke, B., 10 April 2025, in: Applied sciences. 15 (2025), 8, 19 S., 4159Elektronische (Volltext-)VersionPublikation: Beitrag in Fachzeitschrift > Forschungsartikel
• Development and Evaluation of Global-Local Finite Element Models for Solder Joint Reliability under Combined Vibration and Thermal LoadsLyu, C., Meier, K. & Bock, K., 9 April 2025, Proceedings - 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2025. Institute of Electrical and Electronics Engineers (IEEE), 7 S., 11006543Elektronische (Volltext-)VersionPublikation: Beitrag in Buch/Konferenzbericht/Sammelband/Gutachten > Beitrag in Konferenzband
• Integrating life cycle assessment (LCA) and machine learning for sustainable designs: a case study on protective layers made of mineral-bonded fiber-reinforced compositesSalgado, I. D. P., Conrad, F., SIGNORINI, C., Günther, E., Ihlenfeldt, S. & Mechtcherine, V., 9 April 2025, in: The international journal of life cycle assessmentElektronische (Volltext-)VersionPublikation: Beitrag in Fachzeitschrift > Forschungsartikel
• Temperature-Dependent Material Characterization of Back-End-of-Line Copper with Nanoindentation for FEM-Based Wafer Warpage PredictionSingh, P. K., Geisler, H., Machani, K. V., Breuer, D., Meier, K., Kuechenmeister, F. & Bock, K., 9 April 2025, Proceedings - 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2025. Institute of Electrical and Electronics Engineers (IEEE), 13 S., 11006541Elektronische (Volltext-)VersionPublikation: Beitrag in Buch/Konferenzbericht/Sammelband/Gutachten > Beitrag in Konferenzband
• The Worry Gallery: Feasability trial of an anxiety induction method applying generative artificial intelligence and mixed realityBadeja, D., Schier, F., McGinity, M. & Hoyer, J., 8 April 2025Publikation: Beitrag zu Konferenzen > Poster
• Energy-Efficient Aggressive Duty-Cycling of V-band Power AmplifiersBecker, M. G., Gunia, M., Mendez, D. & Ellinger, F., 7 April 2025, in: IEEE access. 13, S. 64638-64652, 15 S.Elektronische (Volltext-)VersionPublikation: Beitrag in Fachzeitschrift > Forschungsartikel
• Low Temperature Atomic Layer Deposition of (00l)-Oriented Elemental BismuthVazquez-Arce, J. L., Amoroso, A., Perez, N., Charvot, J., Naglav-Hansen, D., Zhao, P., Yang, J. & 10 weitere, 7 April 2025, in: Angewandte Chemie - International Edition. e202422578Elektronische (Volltext-)VersionPublikation: Beitrag in Fachzeitschrift > Forschungsartikel
• Transients at the nuclear training and research reactor AKR 2: Experiments and time dependent simulations with Monte Carlo Code SerpentGómez Rodriguez, J. J., Knospe, A., Viebach, M., Lange, C. & Hurtado Gutierrez, A., 6 April 2025Publikation: Beitrag zu Konferenzen > Poster