Publications
The Research Portal (FIS) of TU Dresden provides a detailed search for publications in the School of Engineering Sciences.
18988 Entries
2024
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Trackball-Odometry for Increased Position Accuracy of UAV in Aerial Manipulation Tasks , 2024, VDI Mechatroniktagung 2024. p. 141-146Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Transparenzsteigerung beim Hohlprägewalzen von metallischer Bipolarplatten: Prozessüberwachung mittels maschineninhärenter Sensoren , 2024, In: WT Werkstattstechnik. 114, 1-2, p. 15-20, 6 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
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Tribological Properties of Different Slipper Designs of an Axial Piston Pump , 2024, 18 p.Electronic (full-text) versionResearch output: Contribution to conferences > Paper
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Tribometer for the Investigation of Self-Lubricating Sealing Materials under Realistic Compression Conditions , 2024, 10 p.Electronic (full-text) versionResearch output: Contribution to conferences > Paper
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Trusted Computing Architectures for IoT Devices , 2024, Applied Reconfigurable Computing. Architectures, Tools, and Applications - 20th International Symposium, ARC 2024, Proceedings: 20th International Symposium, ARC 2024 Aveiro, Portugal, March 20–22, 2024 Proceedings. Skliarova, I., Jiménez, P. B., Véstias, M. & Diniz, P. C. (eds.). Springer, Cham, p. 241-254, 13 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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TSN over 5G: Overcoming Challenges and Realizing Integration , 2024, 2024 IEEE 20th International Conference on Factory Communication Systems, WFCS 2024. Mifdaoui, A., Almeida, L., Golatowski, F., Scanzio, S., Santos, P. & Danielis, P. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 1-8, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Understanding the impact of the dielectric layer in modulating the TER of FTJ devices , 2024, ESSERC 2024 - Proceedings: 50th IEEE European Solid-State Electronics Research Conference. IEEE Computer Society, p. 408-411, 4 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Understanding the Substrate Effect on De-embedding Structures Fabricated on SOI Wafers Using Electromagnetic Simulation , 2024, 2024 IEEE 36th International Conference on Microelectronic Test Structures, ICMTS 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Unification in ELHR+ without the Top Concept modulo Cycle-Restricted Ontologies (Extended Abstract) , 2024, Proceedings of the 37th International Workshop on Description Logics (DL'24). Jung, J. C., Giordano, L. & Ozaki, A. (eds.). Bergen, Norway: CEUR-WS.org, 5 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Unlocking Opportunities: Empowering Autistic Adults in Vocational Training and Employment Through Assistive Technologies , 2024, Universal Access in Human-Computer Interaction - 18th International Conference, UAHCI 2024, Held as Part of the 26th HCI International Conference, HCII 2024, Proceedings: 18th International Conference, UAHCI 2024, Held as Part of the 26th HCI International Conference, HCII 2024, Washington, DC, USA, June 29 – July 4, 2024, Proceedings. Antona, M. & Stephanidis, C. (eds.).p. 32–46, 15 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution