Publications
The Research Portal (FIS) of TU Dresden provides a detailed search for publications in the School of Engineering Sciences.
18980 Entries
2007
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Design of a C-Band CMOS Class AB Power Amplifier for an Ultra LowSupply Voltage , 1 May 2007, Proceedings of the International Microwave and Optoelectronics Conference(IMOC). Salvador, BrazilResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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European Project RESOLUTION - Local Positioning Systems based onNovel FMCW Radar , 1 May 2007, Proceedings of the International Microwave and Optoelectronics Conference(IMOC). Salvador, BrazilResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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SYMPAD – A Class Library for Processing Parallel Algorithm Specifications , 1 May 2007, Dresdner Arbeitstagung Schaltungs und Systementwurf (DASS). Dresden, Germany, p. 93-98, 6 p.Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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An impact of a low voltage steady electrical current on the solidification of a binary metal alloy: A numerical study , May 2007, In: Steel Research International. 78, 5, p. 402-408, 7 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
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Bestimmung des Borverlustes aus siedenden Boratlösungen bei Störfallbedingungen in Siedewasserreaktoranlagen , May 2007, Tagungsband Jahrestagung Kerntechnik 2007Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Handling ultra-thin wafers , May 2007, In: Advanced packaging : an IHS Group publication. Vol. 16. p. 32-34+38Research output: Contribution to specialist publication > Feature article/Contribution (Feuilleton)
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Hofstadter butterflies of bilayer graphene , May 2007, In: Physical Review B. 75, 20, 4 p., 201404(R)Electronic (full-text) versionResearch output: Contribution to journal > Research article
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On the measurement of total radiated power in uncalibrated reverberation chambers , May 2007, In: IEEE Transactions on Electromagnetic Compatibility. 49, 2, p. 270-279, 10 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
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The Dependence of Composition, Cooling Rate and Size on the Solidification Behaviour of SnAgCu Solders , 18 Apr 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007. IEEE, p. 1-10, 10 p., 4201150Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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The Effect of Downscaling the Dimensions of Solder Interconnects on their Creep Properties , 18 Apr 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007. IEEE, p. 1-8, 8 p., 4201149Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution