Publications

2024

• PBF-LB of zinc composites modified with nanopowders: Initial insights into powder and part characterizationsSheydaeian, E., Gerdt, L., Stepien, L., Lopez, E., Brückner, F. & Leyens, C., 15 Apr 2024, In: Materials letters. 361, 136076Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Systematic Testing of a ROS Interface Specification BackendMey, J., Podlubne, A., Schöne, R., Gottschaldt, P., Göhringer, D. & Aßmann, U., 15 Apr 2024, Proceedings - 2024 IEEE/ACM 6th International Workshop on Robotics Software Engineering, RoSE 2024. Association for Computing Machinery, Inc, p. 25-30, 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Voltage Programmable Pyroelectric Sensors with ZrO₂-based AntiferroelectricsLomenzo, P. D., Li, S., Xu, B., Mikolajick, T. & Schroeder, U., 15 Apr 2024, In: IEEE sensors journal. 24, 8, p. 12050-12057, 8 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• A Metadata Model for Harmonising Engineering Research Data Across Process and Laboratory BoundariesZinner, M., Conrad, F., Feldhoff, K., Wiemer, H., Weller, J. & Ihlenfeldt, S., 14 Apr 2024, COGNITIVE 2024, The Sixteenth International Conference on Advanced Cognitive Technologies and Applications. Dinet, J. (ed.).p. 30-39, 10 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Understanding the structure formation of plant-based alginate bioinks in 3D-bioprintingBäther, S. & Wagemans, A. M., 14 Apr 2024Research output: Contribution to conferences > Poster
• Erhöhung der Übertragungskapazität des Verteilungsnetzes durch Umstellung bestehender Drehstromleitungen auf Gleichstrom: NetzkonzeptHemken, M., Adam, R., Hildmann, C., Krahmer, S., Backhaus, K., Schegner, P. & Rupp, S., 11 Apr 2024Research output: Contribution to conferences > Paper
• One Flag to Rule Them All? On the Quest for Compiler Optimizations to Improve Fault ToleranceThunig, R., Johannfunke, M., Wang, T. & Schirmeier, H., 11 Apr 2024, Proceedings - 2024 19th European Dependable Computing Conference, EDCC 2024. Institute of Electrical and Electronics Engineers (IEEE), p. 33-40, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Creep characterization of lead-free solder alloys over an extended temperature range used for fatigue modelingDudash, V., Machani, K. V., Meier, K., Geisler, H., Mueller, M., Kuechenmeister, F., Wieland, M. & 1 others, 10 Apr 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Institute of Electrical and Electronics Engineers (IEEE), p. 1-6, 6 p., 10491475Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Degradable polycaprolactone/buffer composites as pH regulating carrier materials for drug delivery and 3D printed biomaterialsSchüler, T., Guder, C., Alt, F., Lorenz, K., Sterzenbach, T., Hannig, C., Wiesmann, H. P. & 1 others, 10 Apr 2024, In: Materialia. 34 (2024), 11 p., 102087Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Numerical Study on the Correlation between Board-level Drop and Shock Tests for Chip-Scale PackagesNguyen, H., Lyu, C., Meier, K. & Bock, K., 10 Apr 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Institute of Electrical and Electronics Engineers (IEEE), p. 1-5, 5 p., 10491520Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution