Publications

2010

• Texture, microstructure and mechanical properties of ultrafine grained aluminum produced by accumulative roll bondingScharnweber, J., Skrotzki, W., Oertel, C., Brokmeier, H., Höppel, H. W., Topic, I. & Jaschinski, J., Oct 2010, In: Advanced Engineering Materials. 12, 10, p. 989-994, 6 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Zum methodischen Konstruieren von Leichtbaustrukturen aus kohlenstofffaserverstärkten KunststoffenHufenbach, W. & Helms, O., Oct 2010, In: Konstruktion. 10, p. 69-74, 6 p.Research output: Contribution to journal > Research article
• Pulsed stress behavior of platinum thin filmsBonfert, D., Gieser, H., Bock, K., Svasta, P. & Ionescu, C., 26 Sep 2010, 2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME). Institute of Electrical and Electronics Engineers (IEEE), p. 83-88, 6 p., 5651534Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• 0.18-V input charge pump with forward body biasing in startup circuit using 65nm CMOSChen, P., Ishida, K., Zhang, X., Okuma, Y., Ryu, Y., Takamiya, M. & Sakurai, T., 22 Sep 2010, IEEE Custom Integrated Circuits Conference 2010. Institute of Electrical and Electronics Engineers (IEEE), p. 1-4, 4 p., 5617444Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• 0.5-V input digital LDO with 98.7% current efficiency and 2.7-µA quiescent current in 65nm CMOSOkuma, Y., Ishida, K., Ryu, Y., Zhang, X., Chen, P., Watanabe, K., Takamiya, M. & 1 others, 22 Sep 2010, IEEE Custom Integrated Circuits Conference 2010. Institute of Electrical and Electronics Engineers (IEEE), p. 1-4, 4 p., 5617586Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• EMI Camera LSI (EMcam) with 12 × 4 on-chip loop antenna matrix in 65-nm CMOS to measure EMI noise distribution with 60-µm spatial precisionMasunaga, N., Ishida, K., Takamiya, M. & Sakurai, T., 22 Sep 2010, IEEE Custom Integrated Circuits Conference 2010. Institute of Electrical and Electronics Engineers (IEEE), p. 1-4, 4 p., 5617413Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Failure mechanism of solder interconnections under thermal cycling conditionsMattila, T. T., Mueller, M., Paulasto-Kröckel, M. & Wolter, K., 16 Sep 2010, 3rd Electronics System Integration Technology Conference ESTC. Institute of Electrical and Electronics Engineers (IEEE), p. 1-8, 8 p., 5642843Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Impact of thermal aging on the thermal fatigue durability of Pb-free solder jointsChauhan, P., Mueller, M., Osterman, M. & Pecht, M., 16 Sep 2010, 3rd Electronics System Integration Technology Conference ESTC. Institute of Electrical and Electronics Engineers (IEEE), p. 1-10, 10 p., 5642908Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Influence of metallographic preparation on EBSD characterization of Cu wire bondsTkachenko, A., Mueller, M., Zerna, T. & Wolter, K., 16 Sep 2010, 3rd Electronics System Integration Technology Conference ESTC. Institute of Electrical and Electronics Engineers (IEEE), p. 1-5, 5 p., 5642846Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Influence of nano silver filler content on properties of ink-jet printed structures for microelectronicsFalat, T., Felba, J., Moscicki, A., Smolarek, A., Bock, K. & Bonfert, D., 16 Sep 2010, 3rd Electronics System Integration Technology Conference ESTC. Institute of Electrical and Electronics Engineers (IEEE), p. 1-5, 5 p., 5642899Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution