Publications

2026

• Enhancing Secret Key Generation in Low-Mobility Scenarios by Locally Generated PilotsPham, T. M., Chorti, A., Fettweis, G. P. & Schaefer, R. F., Jan 2026, 2025 IEEE 102nd Vehicular Technology Conference, VTC 2025-Fall - Proceedings. Institute of Electrical and Electronics Engineers (IEEE)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• First insights into changing cleaning mechanisms based on experimental and numerical investigationsKöhler, H., Golla, C., Drechsel, C. & Rüdiger, F., Jan 2026, In: Food and Bioproducts Processing. 155, p. 45-52, 8 p.Electronic (full-text) versionResearch output: Contribution to journal > Conference article
• Hardware Acceleration for Massive-MIMO Hybrid Beamforming on RISC-V Vector DSPsAcevedo, J., Seeling, P. & Fitzek, F. H., Jan 2026, 2025 IEEE Military Communications Conference, MILCOM 2025. Institute of Electrical and Electronics Engineers (IEEE), p. 144-149, 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Hybrid Quantum-Classical Computers: A Critical Analysis to Quantum Computational ModelsHajizade, A., Bassoli, R. & Fitzek, F. H., Jan 2026, 2025 IEEE Future Networks World Forum: Beyond Connectivity: 6g for a Sustainable and Intelligent Future, FNWF 2025. Institute of Electrical and Electronics Engineers (IEEE), p. 1-6Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Inverse design of spinodoid structures using Bayesian optimizationRaßloff, A., Seibert, P., Kalina, K. A. & Kästner, M., Jan 2026, In: Computational mechanics : solids, fluids, engineered materials, aging infrastructure, molecular dynamics, heat transfer, manufacturing processes, optimization, fracture & integrity. 77, 1, p. 275-296, 22 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Machine learning based impact sensing using piezoelectric sensors: From simulated training data to zero-shot experimental applicationGkertzos, P., Gerritzen, J., Tsakonas, C., Panagiotou, S. H., Kotzakolios, A., Katsidimas, I., Hornig, A. & 4 others, Jan 2026, In: Big Data and Cognitive Computing. 10, 1, 24 p., 5Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Manufacturing, modelling and testing of acoustic liners extended with flexible wallsKohlenberg, F., Neubauer, M., Genßler, J., Radmann, V. & Knobloch, K., Jan 2026, In: CEAS Aeronautical Journal. 17, 1, p. 421-434, 14 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Molecular Communication With Langmuir Adsorption Kinetics: Channel Characteristics and Temporal MemoryZheng, R., Zhou, P., Hofmann, P., Cabrera, J. A. & Fitzek, F. H., Jan 2026, In: IEEE communications letters. 30, p. 787-791, 5 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Q3.5-Format LUT-Based GELU AcceleratorMojumder, S., Matus, E. & Fettweis, G., Jan 2026, International SoC Design Conference 2025, ISOCC 2025 - Proceedings of Technical Papers. Institute of Electrical and Electronics Engineers (IEEE)Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Quantum-Enhanced Hardware Platforms for 6G Mobile Edge ComputingGhaderi, S., Bassoli, R. & Fitzek, F. H., Jan 2026, 2025 IEEE Future Networks World Forum: Beyond Connectivity: 6g for a Sustainable and Intelligent Future, FNWF 2025. Institute of Electrical and Electronics Engineers (IEEE), 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution