Publications

2007

• Textilverbundkeramik für Leichtbaulösungen unter extremen BedingungenRichter, H., Behnisch, T., Hufenbach, W. & Than, E., 15 Jun 2007Research output: Contribution to conferences > Presentation slides
• TR09 Transrapid neuer Generation - effizienter und sparsamerZheng, Q., Ebmeyer, J., Kunze, K. & Hufenbach, W., 15 Jun 2007Research output: Contribution to conferences > Presentation slides
• Zum aktuellen Stand der Mehrkörper-Simulation bei der Bereitstellung von Lastannahmen für GroßantriebeRosenlöcher, T., Hähnel, T., Höfgen, M. & Schlecht, B., 14 Jun 2007, SimPEP – Kongress für Simulation im ProduktentwicklungsprozessResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Maintaining Bernoulli samples over evolving multisetsGemulla, R., Lehner, W. & Haas, P. J., 11 Jun 2007, Proceedings of the Twenty-sixth ACM SIGMOD-SIGACT-SIGART Symposium on Principles of Database Systems, PODS 2007. p. 93-102, 10 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Abbildung komplexer, pulsierender, neuronaler Netzwerke auf spezielle neuronale VLSI HardwareWendt, K., Ehrlich, M., Mayr, C. & Schüffny, R., 1 Jun 2007, Dresdner Arbeitstagung Schaltungs- und Systementwurf (DASS´2007). p. pp. 127-132Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Active Pixel Sensor Arrays in 90/65nm CMOS-Technologies with vertically stacked photodiodesHenker, S., Mayr, C., Schlüßler, J., Schüffny, R., Ramacher, U. & Heittmann, A., 1 Jun 2007, In: International Image Sensor Workshop (IISS). p. 16-19, 4 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Design and Implementation of a high speed LVDS Transmitter and ReceiverAnder, M. & Schüffny, R., 1 Jun 2007, In: Workshop des Arbeitskreises IC-Design im Silicon SaxonyResearch output: Contribution to journal > Research article
• Effect of Composition and Cooling Rate on the Microstructure of SnAgCu-Solder JointsMueller, M., Wiese, S., Roellig, M. & Wolter, K., 1 Jun 2007, 2007 Proceedings 57th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers (IEEE), p. 1579-1588, 10 p., 4250092Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Large Area Cost-Efficient Electronics Systems IntegrationBock, K., Klink, G., Strohhofer, C., Hemmetzberger, D. & Feil, M., 1 Jun 2007, 2007 Proceedings 57th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers (IEEE), p. 1540-1543, 4 p., 4250085Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Modellierung eines Wafer-Scale Systems für pulsgekoppelte neuronale NetzeScholze, S., Ehrlich, M. & Schüffny, R., 1 Jun 2007, Dresdner Arbeitstagung Schaltungs- und Systementwurf (DASS´2007). Hardt, W. (ed.). TUDpress/Thelem Universitätsverlag, p. pp. 61-66Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution