Publications

2006

• Analysis of dynamic loads in multi-megawatt-drive-trainsRosenlöcher, T., Schulze, T., Hähnel, T. & Schlecht, B., 18 Sep 2006, ISMA2006 International Conference on Noise and Vibration EngineeringResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Compact outside-rail circuit structure by single-cascode two-transistor topologyTamtrakarn, A., Ishikuro, H., Ishida, K. & Sakurai, T., 13 Sep 2006, IEEE Custom Integrated Circuits Conference 2006. Institute of Electrical and Electronics Engineers (IEEE), p. 619-622, 4 p., 4115035Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Modeling of High Frequency Noise in SiGe HBTsSakalas, P., Chakravorty, A., Schroter, M., Ramonas, M., Herricht, J., Shimukovitch, A. & Jungemann, C., 8 Sep 2006, 2006 International Conference on Simulation of Semiconductor Processes and Devices. Institute of Electrical and Electronics Engineers (IEEE), p. 271-274, 4 p., 4061631Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• An Energy-Autarkic Micro Sensor SystemWenninger, F., Haberger, K., Bock, K. & Netsch, L., 7 Sep 2006, 2006 1st Electronic Systemintegration Technology Conference. Institute of Electrical and Electronics Engineers (IEEE), Vol. 2. p. 1417-1419, 3 p., 4060922Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• A New Method of Flip Chip Assembly Using a Light Silver Filled GlueFeil, M., Konig, M. & Bock, K., 7 Sep 2006, 2006 1st Electronic Systemintegration Technology Conference. Institute of Electrical and Electronics Engineers (IEEE), Vol. 1. p. 540-543, 4 p., 4060779Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Influence of Cooling Rate and Composition on the Solidification of SnAgCu SoldersMuller, M., Wiese, S. & Wolter, K., 7 Sep 2006, 2006 1st Electronic Systemintegration Technology Conference. Institute of Electrical and Electronics Engineers (IEEE), Vol. 2. p. 1303-1311, 9 p., 4060904Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Electronics packaging for microfluidics applicationsHowitz, S., Rebenklau, L. & Richter, A., 5 Sep 2006, p. 562, 566 p.Research output: Contribution to conferences > Paper
• Vermont - A Versatile Monitoring Toolkit for IPFIX and PSAMPLampert, R. T., Sommer, C., Münz, G. & Dressler, F., 1 Sep 2006, IEEE/IST Workshop on Monitoring, Attack Detection and Mitigation (MonAM 2006). Tübingen, Germany: Institute of Electrical and Electronics Engineers (IEEE), p. 62-65, 4 p.Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Fatigue failure criteria and degradation rules for composites under multiaxial loadingsGude, M., Hufenbach, W., Koch, I. & Protz, R., Sep 2006, In: Mechanics of Composite Materials. 42, 5, p. 443-450, 8 p.Electronic (full-text) versionResearch output: Contribution to journal > Conference article
• Deformation-induced nanostructuring in a Ti-Nb-Ta-In beta alloyXu, W., Kim, K. B., Das, J., Calin, M., Rellinghaus, B. & Eckert, J., 17 Jul 2006, In: Applied physics letters. 89, 3Electronic (full-text) versionResearch output: Contribution to journal > Research article