2023

• Characterization of Embedded and Thinned RF ChipsYin, R., Morath, H. P. E., Hoyer, C., Nieweglowski, K., Meier, K., Wagner, J., Ellinger, F. & 1 others, 14 Sep 2023, 24th European Microelectronics and Packaging Conference, EMPC 2023. IEEE, p. 1-6, 6 p., 10418325Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Digitalisierungsbezogene Kompetenzen: Sichtweisen von Lehrkräften auf Medien-, Anwendungs- und InformatikkompetenzenSpalteholz, W., Leonhardt, T. & Bergner, N., 14 Sep 2023, HDI 2023 Hochschuldidaktik Informatik: 10. Fachtagung Hochschuldidaktik Informatik (HDI) 2023. Desel, J. & Opel, S. (eds.). FernUniversität in Hagen, p. 9-21, 12 p.Research output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report
• Hybrid Lithography Fabrication of Single Mode Optics for Signal Redistribution and CouplingWeyers, D., Nieweglowski, K. & Bock, K., 14 Sep 2023, 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). IEEE, p. 1-8, 8 p., 10418392Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Integration of Multi-Lithography Technologies for the Fabrication of Flexible Optical LinkMistry, A., Nieweglowski, K. & Bock, K., 14 Sep 2023, 24th European Microelectronics and Packaging Conference, EMPC 2023. IEEE, p. 1-5, 5 p., 10418428Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Numerical Study on the Influence of Polyimide Thickness and Curing Temperature on Wafer Bow in Wafer Level PackagingSingh, P. K., Rohlfs, P., Sandmann, G., Machani, K. V., Breuer, D., Meier, K., Kuechenmeister, F. & 2 others, 14 Sep 2023, 24th European Microelectronics and Packaging Conference, EMPC 2023. IEEE, p. 1-6, 6 p., 10418276Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Solvent-antisolvent interactions in metal halide perovskitesBautista-Quijano, J. R., Telschow, O., Paulus, F. & Vaynzof, Y., 14 Sep 2023, In: Chemical communications. 59, 71, p. 10588-10603, 16 p.Electronic (full-text) versionResearch output: Contribution to journal > Review article
• Cell structure analysis of expanded polypropylene bead foams under compressionKoch, I., Preiß, G., Müller-Pabel, M., Grüber, B., Meuchelböck, J., Ruckdäschel, H. & Gude, M., 12 Sep 2023Electronic (full-text) versionResearch output: Contribution to conferences > Abstract
• Interfacial Engineering of Two-Dimensional Metal-Organic Framework Thin Films for Biomimetic Photoadaptative SensorsYang, H., Sun, Q., Liao, Z., Hambsch, M., Liu, X., Wu, D., Jost, B. & 6 others, 12 Sep 2023, In: Chemistry of materials. 35, 17, p. 7144-7153, 10 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Nemo: First Glimpse of a New Rule EngineIvliev, A., Ellmauthaler, S., Gerlach, L., Marx, M., Meißner, M., Meusel, S. & Krötzsch, M., 12 Sep 2023, Proceedings 39th International Conference on Logic Programming. Pontelli, E., Costantini, S., Dodaro, C., Gaggl, S., Calegari, R., Garcez, A. D., Fabiano, F., Mileo, A., Russo, A. & Toni, F. (eds.).p. 333-335, 3 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Novel concepts to construct cost effective geothermal wells with Electro Pulse Power TechnologyNeumann, E., Anders, E., Voigt, M. & Will, F., 12 Sep 2023Research output: Contribution to conferences > Presentation slides