Publications

2024

• The Role of Acceptor Properties on the Hole Transport Mechanism in Low-Donor-Content Organic Solar CellsKublitski, J., Londi, G., Talnack, F., Hambsch, M., Xing, S., Wolansky, J., Mannsfeld, S. C. & 5 others, 23 Apr 2024, In: Chemistry of materials. 36, 8, p. 3555-3562, 8 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• A Method for Automatic Three-Dimensional Particle Tracing Under Laboratory Conditions Using Dynamic X-Ray Computed MicrotomographySiebert, J. & Odenbach, S., 22 Apr 2024, In: Transport in porous media. 151 (2024), 7, p. 1607-1626, 20 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Sensing of indoor temperature using acoustic tomography: Optimizing inaccurate loudspeaker and microphone xyz-coordinatesOthmani, C., Merchel, S. & Altinsoy, M. E., 20 Apr 2024, DAGA 2024 - 50th annual conference for acoustics, 18.-21. March, Hannover, 18–21, Mar. (2024). p. 945-948Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Welcome Message from the ExEn 2024 Workshop OrganizersDroste, J., Klös, V., Schwammberger, M. & Speith, T., 20 Apr 2024, Proceedings - 2024 Workshop on Explainability Engineering, ExEn 2024. Association for Computing Machinery, Inc, p. VI-VIIResearch output: Contribution to book/conference proceedings/anthology/report > Foreword/Postscript
• A 22 nm 10 TOPS Mixed-Precision Neural Network SoC for Image Processing with Energy-Efficient Dilated Convolution SupportFriedrich, S., Wittig, R., Matus, E., Grantz, D., Zeller, M., Benndorf, J. & Fettweis, G., 19 Apr 2024, 2024 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS). Institute of Electrical and Electronics Engineers (IEEE), 3 p., 10531169Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Comparative Analysis of Mechanical Properties of Thermally Sprayed Cu and Zn Coatings on Fiber-Reinforced Plastic for Enhanced EMC ApplicationsGebauer, J., Scheitz, S., Rothe, C., Paul, A., Kanagarajah, P. & Reif, M., 19 Apr 2024, Proceedings of the ITSC 2024: Thermal Spray 2024: Proceedings from the International Thermal Spray Conference. p. 365-375, 11 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Digital Twin in Industrie 4.0 for Embedded SystemsBraunisch, N., Soler Perez Olaya, S., Schmidt, U., Ristin, M., Sadurski, M., Venn, H. W. V. D. & Wollschlaeger, M., 19 Apr 2024, 2024 IEEE 20th International Conference on Factory Communication Systems, WFCS 2024. Mifdaoui, A., Almeida, L., Golatowski, F., Scanzio, S., Santos, P. & Danielis, P. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 1-4, 4 p., 10540968Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Management of Industrial 5G Networks over Asset Administration ShellSoler Perez Olaya, S., Kankanamge, H. K. P., Cainelli, G. P. & Gambal, B., 19 Apr 2024, 2024 IEEE 20th International Conference on Factory Communication Systems (WFCS). Mifdaoui, A., Almeida, L., Golatowski, F., Scanzio, S., Santos, P. & Danielis, P. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 1-4, 4 p., 10540955Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Room Temperature Phosphorescence from Natural, Organic Emitters and Their Application in Industrially Compostable Programmable Luminescent TagsThomas, H., Achenbach, T., Hodgkinson, I. M., Spoerer, Y., Kuehnert, I., Dornack, C., Schellhammer, K. S. & 1 others, 19 Apr 2024, In: Advanced materials. 36 (2024), 26, 9 p., 2310674Electronic (full-text) versionResearch output: Contribution to journal > Research article
• BioRePly – End-of-Life Szenarien von kompostierbarem SperrholzHodgkinson, I., Dornack, C., Siegel, C., Kliem, L. & Wagenführ, A., 18 Apr 2024, Tagungsband des 21. Holztechnologischen Kolloquiums Dresden. Dresden, p. 191-198Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution