2023

• Investigation of quasistatic and dynamic mechanical properties of thermoplastic polyurethane magnetorheological elastomersKare Gowda, D. & Odenbach, S., 1 Aug 2023, In: Journal of magnetism and magnetic materials. 579, 170856Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Investigations on dross formation susceptibility in laser fusion cutting of different stainless steel compositions with emphasis on minor element effectsMahrle, A., Wanski, T., Zeuner, A. T., Herwig, P. & Zimmermann, M., 1 Aug 2023, In: Journal of laser applications. 35, 3, 032001Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Modeling of the SNCR process – Based on a semianalytical spray model approachBeerbaum, D., Bernhardt, D. & Beckmann, M., 1 Aug 2023, In: Thermal science and engineering progress : TSEP. 43, 102008Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Multi-Technology Cooperative Driving: An Analysis Based on PLEXESegata, M., Lo Cigno, R., Hardes, T., Heinovski, J., Schettler, M., Bloessl, B., Sommer, C. & 1 others, 1 Aug 2023, In: IEEE Transactions on Mobile Computing. 22, 8, p. 4792 - 4806, 15 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Opportunistic Airborne Virtual Network Infrastructure for Urban Wireless NetworksHardes, T. & Sommer, C., 1 Aug 2023, In: Computer Communications. 208, p. 220-230, 11 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• An Adaptive, Structure-Aware Intelligent Tutoring System for Learning Management SystemsKucharski, S., Braun, I. & Kubica, T., Aug 2023, Proceedings of the IEEE International Conference on Advanced Learning Technologies (ICALT). Chang, M., Chen, N., Kuo, R., Rudolph, G., Sampson, D. G. & Tlili, A. (eds.). IEEE, p. 367-369, 3 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• A simple lithography-free approach for the fabrication of top-contact OFETs with sub-micrometer channel lengthHaase, K., Talnack, F., Donnhäuser, S., Tahn, A., Löffler, M., Hambsch, M. & Mannsfeld, S. C., Aug 2023, In: Organic electronics. 119, 7 p., 106819Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Digital Engineering Methods in Practical Use during Mechatronic Design ProcessesGerschütz, B., Sauer, C., Kormann, A., Nicklas, S. J., Goetz, S., Roppel, M., Tremmel, S. & 2 others, Aug 2023, In: Designs : open access engineering design journal . 7, 4, 93Electronic (full-text) versionResearch output: Contribution to journal > Review article
• Electric Sail Mission Expeditor, ESME: Software Architecture and Initial ESTCube Lunar Cubesat E-sail Experiment DesignPalos, M., Janhunen, P., Toivanen, P., Tajmar, M., Iakubivskyi, I., Micciani, A., Orsini, N. & 15 others, Aug 2023, In: Aerospace. 10, 8, p. 694, 1 p., 694Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Entropic Risk for Turn-Based Stochastic GamesBaier, C., Chatterjee, K., Meggendorfer, T. & Piribauer, J., Aug 2023, 48th International Symposium on Mathematical Foundations of Computer Science, MFCS 2023. Leroux, J., Lombardy, S. & Peleg, D. (eds.). Schloss Dagstuhl – Leibniz-Zentrum für Informatik, p. 15:1-15:16, 15Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution