2023

• Process Control Principles for Scalable Electrolysis SystemsLorenz, J., Klose, A., Lange, H., Kock, T. & Urbas, L., 15 Sep 2023, 2023 IEEE 28th International Conference on Emerging Technologies and Factory Automation (ETFA). Institute of Electrical and Electronics Engineers (IEEE), p. 1-4, 4 p., 10275330Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• The influence of phase morphology of polycarbonate/polyethersulfone blends on the failure behavior between the blends and polyurethane in the peel testSchneider, K., Bräuer, M., Bobeth, M., Kühnert, I., Malanin, M., Schlenstedt, K. & Pompe, W., 15 Sep 2023, In: Journal of applied polymer science. 140, 35, e54349Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Transformation of process functions to the Module Type Package utilizing System Control DiagramsKock, T., Klose, A., Ingebringsten, I. P., Bittorf, L., Lorenz, J. & Urbas, L., 15 Sep 2023, 2023 IEEE 28th International Conference on Emerging Technologies and Factory Automation (ETFA). Institute of Electrical and Electronics Engineers (IEEE), p. 1-4, 4 p., 10275331Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Characterization of Embedded and Thinned RF ChipsYin, R., Morath, H. P. E., Hoyer, C., Nieweglowski, K., Meier, K., Wagner, J., Ellinger, F. & 1 others, 14 Sep 2023, 24th European Microelectronics and Packaging Conference, EMPC 2023. Institute of Electrical and Electronics Engineers (IEEE), p. 1-6, 6 p., 10418325Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Digitalisierungsbezogene Kompetenzen: Sichtweisen von Lehrkräften auf Medien-, Anwendungs- und InformatikkompetenzenSpalteholz, W., Leonhardt, T. & Bergner, N., 14 Sep 2023, HDI 2023 Hochschuldidaktik Informatik: 10. Fachtagung Hochschuldidaktik Informatik (HDI) 2023. Desel, J. & Opel, S. (eds.). FernUniversität in Hagen, p. 9-21, 12 p.Research output: Contribution to book/conference proceedings/anthology/report > Chapter in book/Anthology/Report
• Hybrid Lithography Fabrication of Single Mode Optics for Signal Redistribution and CouplingWeyers, D., Nieweglowski, K. & Bock, K., 14 Sep 2023, 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). Institute of Electrical and Electronics Engineers (IEEE), p. 1-8, 8 p., 10418392Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Integration of Multi-Lithography Technologies for the Fabrication of Flexible Optical LinkMistry, A., Nieweglowski, K. & Bock, K., 14 Sep 2023, 24th European Microelectronics and Packaging Conference, EMPC 2023. Institute of Electrical and Electronics Engineers (IEEE), p. 1-5, 5 p., 10418428Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Numerical Study on the Influence of Polyimide Thickness and Curing Temperature on Wafer Bow in Wafer Level PackagingSingh, P. K., Rohlfs, P., Sandmann, G., Machani, K. V., Breuer, D., Meier, K., Kuechenmeister, F. & 2 others, 14 Sep 2023, 24th European Microelectronics and Packaging Conference, EMPC 2023. Institute of Electrical and Electronics Engineers (IEEE), p. 1-6, 6 p., 10418276Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Solvent-antisolvent interactions in metal halide perovskitesBautista-Quijano, J. R., Telschow, O., Paulus, F. & Vaynzof, Y., 14 Sep 2023, In: Chemical communications. 59, 71, p. 10588-10603, 16 p.Electronic (full-text) versionResearch output: Contribution to journal > Review article
• Cell structure analysis of expanded polypropylene bead foams under compressionKoch, I., Preiß, G., Müller-Pabel, M., Grüber, B., Meuchelböck, J., Ruckdäschel, H. & Gude, M., 12 Sep 2023Electronic (full-text) versionResearch output: Contribution to conferences > Abstract