Publications

2023

• Robust perception systems for automated, connected, and electrified vehicles: Advances from EU project ArchitectECA2030Reckenzaun, J., Solmaz, S., Goelles, T., Hilbert, M., Weimer, D., Mayer, P., Chromy, A. & 4 others, 13 Dec 2023, In: Transportation Research Procedia. 72, p. 335-342, 8 p.Electronic (full-text) versionResearch output: Contribution to journal > Conference article
• Surface and subsurface material modifications and graded material properties in sheet steel 1.0338 (DC04) and their influence on forming processesZielinski, T., Zettl, B., Lafarge, R., Schmid, H., Riemer, O., Karpuschewski, B., Merklein, M. & 1 others, 13 Dec 2023, In: Production Engineering. 18, 3-4, p. 447–458, 12 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Discrimination of Complex Mixtures Using Carbon Nanotubes-based Multichannel Electronic Nose: Coffee AromasHuang, S., Riemenschneider, L., Ibarlucea, B., Panes Ruiz, L. A. & Cuniberti, G., 12 Dec 2023, 2023 IEEE Nanotechnology Materials and Devices Conference (NMDC). Institute of Electrical and Electronics Engineers (IEEE), p. 124-128, 5 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Wasserstoff: Ortho/Para-Umwandlung und VerflüssigungHaberstroh, C., 12 Dec 2023, In: Chemie-Ingenieur-Technik. 96, 1-2, p. 43-54, 12 p.Electronic (full-text) versionResearch output: Contribution to journal > Review article
• Application and evaluation of classic and demand oriented cooling strategies in context of machine toolsWenkler, E., Steiert, C., Ihlenfeldt, S. & Weber, J., 11 Dec 2023, In: The International Journal of Advanced Manufacturing Technology. 130 (2024), 3-4, p. 1451-1463, 13 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Feasibility and Optimisation of Cu-Sintering under Nitrogen AtmosphereMeyer, J., Gierth, K. F. W., Meier, K. & Bock, K., 8 Dec 2023, Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023. Tay, A., Chui, K. J., Lim, Y. K., Tan, C. S. & Shin, S. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 569-573, 5 p., 10457721Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Improvement in Wafer-to-Wafer Hybrid Bonding Using Optimized Chemical Mechanical Planarization Process for Cu DishingKhurana, G. & Panchenko, I., 8 Dec 2023, 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC). Tay, A., Chui, K. J., Lim, Y. K., Tan, C. S. & Shin, S. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 373-380, 8 p., 10457774Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Study on Using Noisy Synthetic Data for Neural Networks to Assess Thermo-Mechanical Reliability Parameters of Solder InterconnectsAlbrecht, O., Höhne, R. D. J., Barkur, D., Meier, K. & Bock, K., 8 Dec 2023, Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023. Tay, A., Chui, K. J., Lim, Y. K., Tan, C. S. & Shin, S. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 751-756, 6 p., 10457730Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Temperature-dependent Creep Characterization of Lead-free Solder Alloys Using Nanoindentation for Finite Element ModelingDudash, V., Machani, K. V., Meier, K., Geisler, H., Mueller, M., Kuechenmeister, F., Wieland, M. & 1 others, 8 Dec 2023, Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023. Tay, A., Chui, K. J., Lim, Y. K., Tan, C. S. & Shin, S. (eds.). Institute of Electrical and Electronics Engineers (IEEE), p. 757-763, 7 p., 10457727Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Feature causalityDubslaff, C., Weis, K., Baier, C. & Apel, S., 7 Dec 2023, In: Journal of Systems and Software. 209 (2024), 19 p., 111915Electronic (full-text) versionResearch output: Contribution to journal > Research article