2023

• Finite Element Model for Prediction of Back-End-of-Line Process Induced Wafer Bow for Patterned WaferSingh, P. K., Machani, K. V., Breuer, D., Hecker, M., Meier, K., Kuechenmeister, F., Wieland, M. & 1 others, 19 Apr 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, p. 1-10, 10 p., 10100826Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• PEARL: Physical Environment based Augmented Reality Lenses for In-Situ Human Movement AnalysisLuo, W., Yu, Z., Rzayev, R., Satkowski, M., Gumhold, S., McGinity, M. & Dachselt, R., 19 Apr 2023, CHI '23: Proceedings of the 2023 CHI Conference on Human Factors in Computing SystemsElectronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Point Cloud Alignment through Mid-Air Gestures on a Stereoscopic DisplayKrug, K., Satkowski, M., Docea, R., Ku, T. & Dachselt, R., 19 Apr 2023, CHI 2023 - Extended Abstracts of the 2023 CHI Conference on Human Factors in Computing Systems. New York, NY, USA: Association for Computing Machinery (ACM), New York, p. 230:1-230:7Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Spatiality and Semantics - Towards Understanding Content Placement in Mixed RealityEllenberg, M. O., Satkowski, M., Luo, W. & Dachselt, R., 19 Apr 2023, CHI 2023 - Extended Abstracts of the 2023 CHI Conference on Human Factors in Computing Systems. New York, NY, USA: Association for Computing Machinery (ACM), New York, p. 254:1-254:8Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• TmoTA: Simple, Highly Responsive Tool for Multiple Object Tracking AnnotationOyshi, M. T., Vogt, S. & Gumhold, S., 19 Apr 2023, CHI 2023 - Proceedings of the 2023 CHI Conference on Human Factors in Computing Systems. Schmidt, A., Väänänen, K., Goyal, E., Kristensson, P. O., Peters, A., Mueller, S., Williamson, J. R. & Wilson, M. L. (eds.). Association for Computing Machinery, 11 p., 413Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• ProMetaS – A Metadata Schema for Process Engineering and IndustrySherpa, L., Müller-Pfefferkorn, R., Tolksdorf, G., Khaydarov, V., Wiedau, M. & Urbas, L., 18 Apr 2023, In: Chemie-Ingenieur-Technik. 95, 7, p. 1041-1048, 8 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Proton, deuteron and triton flow measurements in Au+Au collisions at √sNN=2.4 GeVHADES collaboration, Adamczewski-Musch, J., Arnold, O., Behnke, C., Belounnas, A., Berger-Chen, J. C., Blanco, A. & 44 others, 18 Apr 2023, In: European Physical Journal A. 59, 4, p. 1-21, 21 p., 80Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Repairing Annulus Fibrosus Fissures Using Methacrylated Gellan Gum Combined with Novel SilkCroft, A. S., Ćorluka, S., Fuhrer, J., Wöltje, M., Silva-Correia, J., Oliveira, J. M., Erbach, G. F. & 2 others, 18 Apr 2023, In: Materials. 16, 8, 3173Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Minimizing Energy Cost in PV Battery Storage Systems using Reinforcement LearningHartel, F. & Bocklisch, T., 17 Apr 2023, In: IEEE access. 11, p. 39855-39865, 11 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Measurement of vapour pressure, miscibility and thermal conductivity for binary and ternary refrigerant lubricant mixtures in the context of heat pump tumble dryersStöckel, K., Barta, R. B. & Thomas, C., 16 Apr 2023, In: International Journal of Refrigeration. 152, p. 223-233, 11 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article