Publications

2023

• Analysis of Surface Roughness with 3D SAR Imaging at 1.5 THzBatra, A., Ivanenko, Y., Vu, V. T., Wiemeler, M., Pettersson, M. I., Goehringer, D. & Kaiser, T., 31 Oct 2023, IRMMW-THz 2023 - 48th Conference on Infrared, Millimeter, and Terahertz Waves. Institute of Electrical and Electronics Engineers (IEEE), 2 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Mango-IO: I/O Metrics Consistency AnalysisLiem, R., Oeste, S., Lofstead, J. & Kunkel, J., 31 Oct 2023, Proceedings - 2023 IEEE International Conference on Cluster Computing Workshops and Posters, CLUSTER Workshops 2023. Institute of Electrical and Electronics Engineers (IEEE), p. 18-24, 7 p., 10321835Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Modulation Doping of Silicon Nanowires to Tune the Contact Properties of Nano-Scale Schottky BarriersNagarajan, S., Hiller, D., Ratschinski, I., König, D., Smith, S. C., Mikolajick, T. & Trommer, J., 31 Oct 2023, In: Advanced materials interfaces. 11(2024), 1, 8 p., 2300600Electronic (full-text) versionResearch output: Contribution to journal > Research article
• PMC-VIS: An Interactive Visualization Tool for Probabilistic Model CheckingKorn, M., Méndez, J., Klüppelholz, S., Langner, R., Baier, C. & Dachselt, R., 31 Oct 2023, Software Engineering and Formal Methods: 21st International Conference, SEFM 2023, Eindhoven, The Netherlands, November 6-10, 2023, Proceedings. Ferreira, C. & Willemse, T. A. C. (eds.). Cham: Springer, Cham, p. 361-375, 15 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Robot-assisted Manufacturing Technology for 3D Non-metallic Reinforcement Structures in the Construction ApplicationsFriese, D., Hahn, L., Le Xuan, H., Mersch, J., Neef, T., Mechtcherine, V. & Cherif, C., 31 Oct 2023, In:  Buildings : open access journal. 13, 11, 2748Electronic (full-text) versionResearch output: Contribution to journal > Research article
• THz-pump / MIR-probe nanospectroscopy on Si-doped GaAs-InGaAs core-shell nanowiresLuferau, A., Obst, M., Winnerl, S., Kehr, S. C., Dimakis, E., Pashkin, A., Kaps, F. & 2 others, 31 Oct 2023, IRMMW-THz 2023 - 48th Conference on Infrared, Millimeter, and Terahertz Waves. IEEE Computer Society, 2 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Ein modulares Leistungsrechnungsprogramm für konventionelle und hybrid-elektrische FlugantriebeKrüger, T., Wiegand, M., Condriuc, I., Schuchard, L. & Mailach, R., 27 Oct 2023, 10 p.Electronic (full-text) versionResearch output: Contribution to conferences > Paper
• Influence of Dielectric Capping on the Optical Properties of Two-Dimensional Transition-Metal Dichalcogenides: Implications for Nano-OptoelectronicsLi, Y., Steuer, O., Lin, K., Samad, F., Sokolova, D., Erbe, A., Helm, M. & 2 others, 27 Oct 2023, In: ACS Applied Optical Materials. 1, 10, p. 1733-1741, 9 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Understanding the Impact of Active-to-Passive Area Ratio on Deformation in One-Dimensional Dielectric Elastomer Actuators with Uniaxial Strain StateLiebscher, H., Koenigsdorff, M., Endesfelder, A., Mersch, J., Zimmermann, M. & Gerlach, G., 27 Oct 2023, In: Materials. 16, 21, 6897Electronic (full-text) versionResearch output: Contribution to journal > Research article
• High-performance Deterministic Concurrency Using Lingua FrancaMenard, C., Lohstroh, M., Bateni, S., Chorlian, M., Deng, A., Donovan, P., Fournier, C. & 6 others, 26 Oct 2023, In: ACM transactions on architecture and code optimization. 20, 4, 29 p., 48Electronic (full-text) versionResearch output: Contribution to journal > Research article