2023

• Humidity Dependence of the Dielectric Constant of a Thermosetting PolyurethaneLiebscher, H., Suresh, J. N., Li, H., Mersch, J., Wiesner, S. & Gerlach, G., 2023, Proceedings of International Workshop on Impedance Spectroscopy, IWIS 2023. Institute of Electrical and Electronics Engineers Inc., p. 63-66, 4 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Hybrid bond and nanowired bump technologies for high density interconnect formation on wafer levelPanchenko, J., Wenzel, L., Bickel, S., Rudolph, C. & Shehzad, A., 2023Electronic (full-text) versionResearch output: Contribution to conferences > Presentation slides
• Hybrid-Lithography for the Master of Multi-ModeWaveguides NIL StampMistry, A., Nieweglowski, K. & Bock, K., 2023, 2023 46th International Spring Seminar on Electronics Technology, ISSE 2023. IEEE Computer SocietyElectronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Hybrid Spiking and Artificial Neural Networks for Radar-Based Gesture RecognitionGerhards, P., Weih, M., Huang, J., Knobloch, K. & Mayr, C. G., 2023, 2023 8th International Conference on Frontiers of Signal Processing, ICFSP 2023. Institute of Electrical and Electronics Engineers Inc., p. 83-87, 5 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Hybrid Testbed for Security Research in Software-Defined NetworksWindisch, F., Abedi, K., Doan, T., Strufe, T. & Nguyen, G. T., 2023, 2023 IEEE Conference on Network Function Virtualization and Software Defined Networks, NFV-SDN 2023 - Proceedings. Fitzek, F. H., Horner, L., Gharbaoui, M., Nguyen, G., Gu, R. & Meuser, T. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 147-152, 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• HYDRA - High Yield Dense Robotic ArmsGrohmann, A. I., Peters, F., Kuß, D., Sossalla, P. & Fitzek, F. H., 2023, 2023 3rd International Conference on Electrical, Computer, Communications and Mechatronics Engineering (ICECCME). p. 1-6, 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Identification and classification of uncertainties as the foundation of agile methodsPendzik, M., Sembdner, P. & Paetzold, K., 2023, In: Proceedings of the Design Society. 3, p. 2165-2174, 10 p.Electronic (full-text) versionResearch output: Contribution to journal > Conference article
• Illustration of the Usable AI Paradigm in Production-Engineering Implementation SettingsWiemer, H., Conrad, F., Lang, V., Boos, E., Mälzer, M., Feldhoff, K., Drowatzky, L. & 2 others, 2023, Artificial Intelligence in HCI - 4th International Conference, AI-HCI 2023, Held as Part of the 25th HCI International Conference, HCII 2023, Proceedings. Degen, H. & Ntoa, S. (eds.). Springer Science and Business Media B.V., p. 640-661, 22 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Image quality enhancement for ultra-thin lensless multi-core fiber phase endoscopesSun, J., Koukourakis, N. & Czarske, J. W., 2023, Quantitative Phase Imaging IX. Liu, Y. & Park, Y. (eds.). SPIE - The international society for optics and photonics, Bellingham, 1238904Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Impact analysis of compression preloaded honeycomb sandwich structuresFischer, C. F., Hähnel, F., Wolf, K. & Markmiller, J. F. C., 2023, In: Journal of Sandwich Structures & Materials. 26, 3, p. 350-372, 23 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article