Publications
The Research Portal (FIS) of TU Dresden provides a detailed search for publications in the School of Engineering Sciences.
18959 Entries
2023
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HORA: Joint Handover and Resource Allocation on 3D Networks for Industrial IoT , 2023, 28th European Wireless Conference, EW 2023. VDE Verlag, Berlin [u. a.], p. 36-41, 6 p.Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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How Do OS and Application Schedulers Interact? An Investigation with Multithreaded Applications , 2023, Euro-Par 2023: Parallel Processing - 29th International Conference on Parallel and Distributed Computing, Proceedings. Cano, J., Dikaiakos, M. D., Papadopoulos, G. A., Pericàs, M. & Sakellariou, R. (eds.). Cham: Springer Nature Switzerland, Dortrecht [u. a.], p. 214-228, 15 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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How to Get Away with OpenAirInterface: A practical Guide to 5G RAN Configuration , 2023, 2023 3rd International Conference on Electrical, Computer, Communications and Mechatronics Engineering (ICECCME). Institute of Electrical and Electronics Engineers Inc., p. 1-6Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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How to measure the accessibility maturity of organizations - A survey on accessibility maturity models for higher education. , 2023, In: Frontiers in Computer Science. 5, 1134320Electronic (full-text) versionResearch output: Contribution to journal > Review article
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How to support and integrate operators in CPPS: Insights from competency modelling for adapt and exchange scenarios , 2023, Intelligent Human Systems Integration (IHSI 2023): Integrating People and Intelligent Systems. p. 550–560Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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How to Trade Reliability for Security in Machine-Type Communications: Leakage-Failure Probability Minimization , 2023, ICC 2023 - IEEE International Conference on Communications: Sustainable Communications for Renaissance. Zorzi, M., Tao, M. & Saad, W. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 4353-4359, 7 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Humidity Dependence of the Dielectric Constant of a Thermosetting Polyurethane , 2023, Proceedings of International Workshop on Impedance Spectroscopy, IWIS 2023. Institute of Electrical and Electronics Engineers Inc., p. 63-66, 4 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Hybrid bond and nanowired bump technologies for high density interconnect formation on wafer level , 2023Electronic (full-text) versionResearch output: Contribution to conferences > Presentation slides
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Hybrid-Lithography for the Master of Multi-ModeWaveguides NIL Stamp , 2023, 2023 46th International Spring Seminar on Electronics Technology, ISSE 2023. IEEE Computer SocietyElectronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
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Hybrid Spiking and Artificial Neural Networks for Radar-Based Gesture Recognition , 2023, 2023 8th International Conference on Frontiers of Signal Processing, ICFSP 2023. Institute of Electrical and Electronics Engineers Inc., p. 83-87, 5 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution