2023

• Intermetallic Growth Study of Ultra-Thin Copper and Tin Bilayer for Hybrid Bonding ApplicationsKhurana, G. & Panchenko, I., 2023, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC). Institute of Electrical and Electronics Engineers Inc., p. 866-871, 6 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Interplay Between Priority Queues and Controlled Delay in Programmable Data PlanesDoan, T. V., Scheinert, T., Lhamo, O., Cabrera, J. A., Fitzek, F. H. & Nguyen, G. T., 2023, 2023 18th Wireless On-Demand Network Systems and Services Conference, WONS 2023. Institute of Electrical and Electronics Engineers Inc., p. 64-71, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Investigating the Impact of Non-Volatile Memories on Energy-Efficiency of Coarse-Grained Reconfigurable ArchitecturesAliagha, E., Iskandar, V., Enseleit, S. & Gohringer, D., 2023, Proceedings - 2023 26th Euromicro Conference on Digital System Design, DSD 2023. Niar, S., Ouarnoughi, H. & Skavhaug, A. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 748-755, 8 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Investigation of a Heat Pump Dishwasher with Natural Refrigerant MixtureStöckel, K., Mickoleit, E., Busching, F., Barta, R. B. & Thomas, C., 2023Research output: Contribution to conferences > Paper
• Investigation of a novel CO₂ ultrahigh-lift ejector cycle with an additional subcooling heat exchangerHerden, D., Doerffel, C., Barta, R. B. & Thomas, C., 2023, 11 p.Electronic (full-text) versionResearch output: Contribution to conferences > Paper
• Investigation of Complex Electrical Properties of Concrete during Decommissioning of Nuclear Power Plants: An Experimental AnalysisNurjahan, T., Schleicher, E., Hampel, U. & De Assis Dias, F., 2023, Proceedings of International Workshop on Impedance Spectroscopy, IWIS 2023. Institute of Electrical and Electronics Engineers Inc., p. 56-60, 5 p.Electronic (full-text) versionResearch output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Investigation of Recovery Phenomena in Hf0.5Zr0.5O2-based 1T1C FeRAMOkuno, J., Yonai, T., Kunihiro, T., Shuto, Y., Alcala, R., Lederer, M., Seidel, K. & 4 others, 2023, In: IEEE journal of the Electron Devices Society. 11, p. 43-46, 4 p.Electronic (full-text) versionResearch output: Contribution to journal > Research article
• Investigations on energy-efficient energy conversion in the edge banding processGottlöber, C., Hausmann, J., Herzberg, M., Engelmann, S., Müller, V. & Wittenberg, M., 2023, Proceedings of the 25th International Wood Machining Seminar (IWMS-25), 2023, Nagoya, Japan, 04.–07.10.2023Research output: Contribution to book/conference proceedings/anthology/report > Conference contribution
• Investigations on energy-efficient energy conversion in the edge banding processGottlöber, C., Hausmann, J., Herzberg, M., Engelmann, S., Müller, V., Wittenberg, M. & Hofmann, W., 2023Research output: Contribution to conferences > Poster
• Investigations On The Surface Quality Of Metal Parts Produced Via Gel CastingRiecker, S., Teuber, R., Studnitzky, T. & Weißgärber, T., 2023Electronic (full-text) versionResearch output: Contribution to conferences > Paper